Study of Through-Silicon-Via Impact on the 3-D Stacked IC Layout
Dae Hyun Kim, Athikulwongse, K., Sung Kyu Lim
Published in IEEE transactions on very large scale integration (VLSI) systems (01.05.2013)
Published in IEEE transactions on very large scale integration (VLSI) systems (01.05.2013)
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Journal Article
3D-MAPS: 3D Massively parallel processor with stacked memory
Dae Hyun Kim, Athikulwongse, K., Healy, M., Hossain, M., Moongon Jung, Khorosh, I., Kumar, G., Young-Joon Lee, Lewis, D., Tzu-Wei Lin, Chang Liu, Panth, S., Pathak, M., Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Loh, G., Hsien-Hsin Lee, Sung Kyu Lim
Published in 2012 IEEE International Solid-State Circuits Conference (01.02.2012)
Published in 2012 IEEE International Solid-State Circuits Conference (01.02.2012)
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Conference Proceeding
Stress-driven 3D-IC placement with TSV keep-out zone and regularity study
Athikulwongse, K, Chakraborty, A, Jae-Seok Yang, Pan, D Z, Sung Kyu Lim
Published in 2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (01.11.2010)
Published in 2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (01.11.2010)
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Conference Proceeding
Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory
Healy, M B, Athikulwongse, K, Goel, R, Hossain, M M, Kim, D H, Young-Joon Lee, Lewis, D L, Tzu-Wei Lin, Chang Liu, Moongon Jung, Ouellette, B, Pathak, M, Sane, H, Guanhao Shen, Dong Hyuk Woo, Xin Zhao, Loh, G H, Lee, H S, Sung Kyu Lim
Published in IEEE Custom Integrated Circuits Conference 2010 (01.09.2010)
Published in IEEE Custom Integrated Circuits Conference 2010 (01.09.2010)
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Conference Proceeding
A study of Through-Silicon-Via impact on the 3D stacked IC layout
Dae Hyun Kim, Athikulwongse, K., Sung Kyu Lim
Published in 2009 IEEE/ACM International Conference on Computer-Aided Design - Digest of Technical Papers (01.11.2009)
Published in 2009 IEEE/ACM International Conference on Computer-Aided Design - Digest of Technical Papers (01.11.2009)
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Conference Proceeding
Exploiting die-to-die thermal coupling in 3D IC placement
Athikulwongse, Krit, Pathak, Mohit, Lim, Sung Kyu
Published in DAC Design Automation Conference 2012 (03.06.2012)
Published in DAC Design Automation Conference 2012 (03.06.2012)
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Conference Proceeding
Design for manufacturability and reliability for TSV-based 3D ICs
Pan, D. Z., Sung Kyu Lim, Athikulwongse, K., Moongon Jung, Mitra, J., Jiwoo Pak, Pathak, M., Jae-seok Yang
Published in 17th Asia and South Pacific Design Automation Conference (01.01.2012)
Published in 17th Asia and South Pacific Design Automation Conference (01.01.2012)
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Conference Proceeding
Thermal analysis and optimization of 2.5-D integrated voltage regulator
Taigon Song, Sturcken, N., Athikulwongse, K., Shepard, K., Sung Kyu Lim
Published in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2012)
Published in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2012)
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Conference Proceeding
Buffered clock tree sizing for skew minimization under power and thermal budgets
Athikulwongse, K., Xin Zhao, Sung Kyu Lim
Published in 2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC) (01.01.2010)
Published in 2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC) (01.01.2010)
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Conference Proceeding