Thermal and mechanical simulations of 3D packages with custom high bandwidth memory (HBM)
Chatterjee, Kamalika, Li, Yan, Chang, Hochan, Damadam, Mohsen, Asrar, Pouya, Kim, Jaechoon, Jeong, Glen, Kim, WooPoung
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Flow visualization of two phase flow of R245fa in a microgap with integrated staggered pin fins
Asrar, Pouya, Xuchen Zhang, Green, Craig E., Kottke, Peter A., Sarvey, Thomas E., Fedorov, Andrei, Bakir, Muhannad S., Joshi, Yogendra K.
Published in 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) (01.03.2016)
Published in 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) (01.03.2016)
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Conference Proceeding
Flow boiling of R245fa in a microgap with integrated staggered pin fins
Asrar, Pouya, Xuchen Zhang, Woodrum, Casey D., Green, Craig E., Kottke, Peter A., Sarvey, Thomas E., Sitaraman, Suresh, Fedorov, Andrei, Bakir, Muhannad, Joshi, Yogendra K.
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
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Conference Proceeding