An Advanced Finite Element Model of the Cu Pillar Solder Reflow Assembly
Zhibo, Cao, Baran, Pekkolay, Aslihan, Okur, Bruno, Heusdens, Corrado, Carta, Mehmet, Kaynak
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
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