Incomplete fill for FlipChip design in MAP mold package
Chiew, Chong Chee, How, Chong Meng, Asentista, Calo Paularmand, Sidik, Norsuhaili Mohd
Published in 36th International Electronics Manufacturing Technology Conference (01.11.2014)
Published in 36th International Electronics Manufacturing Technology Conference (01.11.2014)
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