Development of a Monolithic Active Pixel Sensor Using SOI Technology With a Thick Device Layer
Marczewski, J., Grabiec, P., Kucharski, K., Tomaszewski, D., Kucewicz, W., Kusiak, T., Niemiec, H., Sapor, M., Ruddell, F.H., Armstrong, B.M., Gamble, H.S., Loster, B.W., Majewski, S.
Published in IEEE transactions on nuclear science (01.02.2010)
Published in IEEE transactions on nuclear science (01.02.2010)
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Journal Article
Atomic layer deposition of hafnium oxide dielectrics on silicon and germanium substrates
McNeill, D. W., Bhattacharya, S., Wadsworth, H., Ruddell, F. H., Mitchell, S. J. N., Armstrong, B. M., Gamble, H. S.
Published in Journal of materials science. Materials in electronics (01.02.2008)
Published in Journal of materials science. Materials in electronics (01.02.2008)
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Journal Article
Conference Proceeding
Investigation into the selectivity of CVD iron from Fe(CO) 5 precursor on various metal and dielectric patterned substrates
Bain, M.F., Low, Y.H., Bien, D.C.S., Montgomery, J.H., Armstrong, B.M., Gamble, H.S.
Published in Surface & coatings technology (25.09.2007)
Published in Surface & coatings technology (25.09.2007)
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Journal Article
Conference Proceeding
SiGe HBTs on bonded SOI incorporating buried silicide layers
Bain, M., El Mubarek, H.A.W., Bonar, J.M., Wang, Y., Buiu, O., Gamble, H., Armstrong, B.M., Hemment, P.L.F., Hall, S., Ashburn, P.
Published in IEEE transactions on electron devices (01.03.2005)
Published in IEEE transactions on electron devices (01.03.2005)
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Journal Article
Selective deposition of CVD iron on silicon dioxide and tungsten
Low, Y.H., Bain, M.F., Bien, D.C.S., Montgomery, J.H., Armstrong, B.M., Gamble, H.S.
Published in Microelectronic engineering (01.11.2006)
Published in Microelectronic engineering (01.11.2006)
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Journal Article
Conference Proceeding
Germanium on sapphire substrates for system on a chip
Gamble, H.S., Armstrong, B.M., Baine, P.T., Low, Y.H., Rainey, P.V., Low, Y.W., McNeill, D.W., Mitchell, S.J.N., Montgomery, J.H., Ruddell, F.H.
Published in Materials science in semiconductor processing (01.10.2008)
Published in Materials science in semiconductor processing (01.10.2008)
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Journal Article
Conference Proceeding
Composition and stress analysis in Si structures using micro-raman spectroscopy
McCarthy, J., Perova, T. S., Moore, R. A., Bhattacharya, S., Gamble, H., Armstrong, B. M.
Published in Scanning (01.09.2004)
Published in Scanning (01.09.2004)
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Journal Article
Optimisation and scaling of interfacial GeO2 layers for high-κ gate stacks on germanium and extraction of dielectric constant of GeO2
Murad, S.N.A., Baine, P.T., McNeill, D.W., Mitchell, S.J.N., Armstrong, B.M., Modreanu, M., Hughes, G., Chellappan, R.K.
Published in Solid-state electronics (01.12.2012)
Published in Solid-state electronics (01.12.2012)
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Journal Article
Conference Proceeding
Ultralow silicon substrate noise crosstalk using metal Faraday cages in an SOI technology
Stefanou, S., Hamel, J.S., Baine, P., Bain, M., Armstrong, B.M., Gamble, H.S., Kraft, M., Kemhadjian, H.A.
Published in IEEE transactions on electron devices (01.03.2004)
Published in IEEE transactions on electron devices (01.03.2004)
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Web Resource
Morphological and functional characterization of beta TC-6 cells--an insulin-secreting cell line derived from transgenic mice
Poitout, V., Stout, L. E., Armstrong, M. B., Walseth, T. F., Sorenson, R. L., Robertson, R. P.
Published in Diabetes (New York, N.Y.) (01.03.1995)
Published in Diabetes (New York, N.Y.) (01.03.1995)
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Journal Article
Cross-talk suppression in SOI substrates
Baine, P., Jin, M., Gamble, H.S., Armstrong, B.M., Linton, D., Mohammed, F.
Published in Solid-state electronics (01.09.2005)
Published in Solid-state electronics (01.09.2005)
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Journal Article
Tungsten silicide contacts to polycrystalline silicon and silicon–germanium alloys
Srinivasan, G., Bain, M.F., Bhattacharyya, S., Baine, P., Armstrong, B.M., Gamble, H.S., McNeill, D.W.
Published in Materials science & engineering. B, Solid-state materials for advanced technology (15.12.2004)
Published in Materials science & engineering. B, Solid-state materials for advanced technology (15.12.2004)
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Journal Article
Low-temperature plasma-enhanced chemical vapor deposition of tungsten and tungsten nitride
BAIN, M. F, ARMSTRONG, B. M, GAMBLE, H. S
Published in Journal of materials science. Materials in electronics (01.05.2003)
Published in Journal of materials science. Materials in electronics (01.05.2003)
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Conference Proceeding
Journal Article
Surface electromigration in copper interconnects
McCusker, N.D, Gamble, H.S, Armstrong, B.M
Published in Microelectronics and reliability (01.01.2000)
Published in Microelectronics and reliability (01.01.2000)
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Journal Article
Electrical characterization of SOI substrates incorporating WSix ground planes
BAIN, M, JIN, M, LOH, S. H, BAINE, P, ARMSTRONG, B. M, GAMBLE, H. S, MCNEILL, D. W
Published in IEEE electron device letters (01.02.2005)
Published in IEEE electron device letters (01.02.2005)
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Journal Article
Effect of deposition temperature on the formation of CoSi2 through the rapid thermal annealing of CVD cobalt
Bain, M.F., Deo, N., Armstrong, B.M., Gamble, H.S.
Published in Microelectronic engineering (01.10.2004)
Published in Microelectronic engineering (01.10.2004)
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Journal Article
Investigation of stress and structural damage in H and He implanted Ge using micro-Raman mapping technique on bevelled samples
Wasyluk, J., Rainey, P. V., Perova, T. S., Mitchell, S. J. N., McNeill, D. W., Gamble, H. S., Armstrong, B. M., Hurley, R.
Published in Journal of Raman spectroscopy (01.03.2012)
Published in Journal of Raman spectroscopy (01.03.2012)
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Journal Article
Determination of band offsets in strained-Si heterolayers
Maiti, C.K., Samanta, S.K., Chatterjee, S., Dalapati, G.K., Bhattacharya, S., Armstrong, B.M., Gamble, H.S., McCarthy, J., Perova, T.S., Moore, R.A.
Published in Thin solid films (01.09.2004)
Published in Thin solid films (01.09.2004)
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Journal Article
SiGe HBTs on bonded wafer substrates
Hall, S, Lamb, A.C, Bain, M, Armstrong, B.M, Gamble, H, El Mubarek, H.A.W, Ashburn, P
Published in Microelectronic engineering (01.11.2001)
Published in Microelectronic engineering (01.11.2001)
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Conference Proceeding