300-mm Production-Worthy Magnetically Enhanced Non-Bosch Through-Si-Via Etch for 3-D Logic Integration
Teh, W H, Caramto, R, Chidambaram, Thenappan, Wei Wang, Arkalgud, Sitaram R, Saito, T, Maruyama, K, Maekawa, Kaoru
Published in IEEE transactions on semiconductor manufacturing (01.05.2010)
Published in IEEE transactions on semiconductor manufacturing (01.05.2010)
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PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
Katkar, Rajesh, DeLaCruz, Javier A, Sitaram, Arkalgud R, Haba, Belgacem
Year of Publication 05.10.2023
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Year of Publication 05.10.2023
Patent
A 16-Mb MRAM featuring bootstrapped write drivers
Gogl, D., Arndt, C., Barwin, J.C., Bette, A., DeBrosse, J., Gow, E., Hoenigschmid, H., Lammers, S., Lamorey, M., Yu Lu, Maffitt, T., Maloney, K., Obermaier, W., Sturm, A., Viehmann, H., Willmott, D., Wood, M., Gallagher, W.J., Mueller, G., Sitaram, A.R.
Published in IEEE journal of solid-state circuits (01.04.2005)
Published in IEEE journal of solid-state circuits (01.04.2005)
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Conference Proceeding