Enabling medium thick gate oxide devices in 22FDX® technology for switch and high-performance amplifier application
Herrmann, Tom, Zaka, Alban, Zhao, Zhixing, Syamal, Binit, Arfaoui, Wafa, Jain, Ruchil, Chang, Ming-Cheng, Jain, Sameer, Ong, Shih Ni
Published in Solid-state electronics (01.01.2023)
Published in Solid-state electronics (01.01.2023)
Get full text
Journal Article
22FDX® Device Optimization for mmW PA
Chang, Mingcheng, Al-Husseini, Zaid, Syed, Shafi, Arfaoui, Wafa, Chen, Tianbing, Knorr, Andreas
Published in ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC) (11.09.2023)
Published in ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC) (11.09.2023)
Get full text
Conference Proceeding
Reliability-Conscious MOSFET Compact Modeling with Focus on the Defect-Screening Effect of Hot-Carrier Injection
Vyas, Pratik B., Pimparkar, Ninad, Tu, Robert, Arfaoui, Wafa, Bossu, Germain, Siddabathula, Mahesh, Lehmann, Steffen, Goo, Jung-Suk, Icel, Ali B.
Published in 2021 IEEE International Reliability Physics Symposium (IRPS) (01.03.2021)
Published in 2021 IEEE International Reliability Physics Symposium (IRPS) (01.03.2021)
Get full text
Conference Proceeding
Off-state Impact on FDSOI Ring Oscillator Degradation under High Voltage Stress
Trommer, Jens, Havel, Viktor, Chohan, Talha, Mehmood, Furqan, Slesazeck, Stefan, Krause, Gernot, Bossu, Germain, Arfaoui, Wafa, Muhlhoff, Armin, Mikolajick, T.
Published in 2018 International Integrated Reliability Workshop (IIRW) (01.10.2018)
Published in 2018 International Integrated Reliability Workshop (IIRW) (01.10.2018)
Get full text
Conference Proceeding
(Invited) Effect of SOI Substrate on CMOS Devices Reliability
Federspiel, Xavier, Arfaoui, Wafa, Angot, Damien, Monsieur, Frederic, Rafik, Mustapha, Mora, Pascal, Cacho, Florian, Roy, David, Huard, Vincent
Published in ECS transactions (26.03.2014)
Published in ECS transactions (26.03.2014)
Get full text
Journal Article
Analysis of RF Stress Influence on Large-Signal Performance of 22nm FDSOI CMOS Transistors utilizing Waveform Measurement
Huynh, Dang Khoa, Le, Quang Huy, Lehmann, Steffen, Zhao, Zhixing, Bossu, Germain, Arfaoui, Wafa, Wang, Defu, Kampfe, Thomas, Rudolph, Matthias
Published in 2021 16th European Microwave Integrated Circuits Conference (EuMIC) (03.04.2022)
Published in 2021 16th European Microwave Integrated Circuits Conference (EuMIC) (03.04.2022)
Get full text
Conference Proceeding
22FDXⓇ EDMOS for 5G mmW Power Amplifier Applications
Chang, Mingcheng, Al-Husseini, Zaid, Syed, Shafi, Ong, Shih Ni, Chan, Lye Hock Kelvin, Arfaoui, Wafa, Lipp, Dieter, Veeramani, Elan, Mazurier, Jerome, Knorr, Andreas, Comfoltey, Nick, Chen, Tianbing
Published in 2023 18th European Microwave Integrated Circuits Conference (EuMIC) (18.09.2023)
Published in 2023 18th European Microwave Integrated Circuits Conference (EuMIC) (18.09.2023)
Get full text
Conference Proceeding
Impact of Off-State Stress on SiGe-channel p-FETs in 22nm FDSOI under Large-Signal Operation
Huynh, Dang Khoa, Le, Quang Huy, Lehmann, Steffen, Zhao, Zhixing, Bossu, Germain, Arfaoui, Wafa, Kampfe, Thomas, Rudolph, Matthias
Published in 2023 18th European Microwave Integrated Circuits Conference (EuMIC) (18.09.2023)
Published in 2023 18th European Microwave Integrated Circuits Conference (EuMIC) (18.09.2023)
Get full text
Conference Proceeding
(Invited) Effect of SOI Substrate on CMOS Devices Reliability
Federspiel, Xavier, Arfaoui, Wafa, Angot, Damien, Monsieur, Frederic, Rafik, Mustapha, Mora, Pascal, Cacho, Florian, Roy, David, Huard, Vincent
Published in Meeting abstracts (Electrochemical Society) (01.04.2014)
Published in Meeting abstracts (Electrochemical Society) (01.04.2014)
Get full text
Journal Article
Implication of Self-Heating Effect on Device Reliability Characterization of Multi-Finger n-MOSFETs on 22FDSOI
Chohan, Talha, Zhao, Zhixing, Lehmann, Steffen, Arfaoui, Wafa, Bossu, Germain, Trommer, Jens, Slesazeck, Stefan, Mikolajick, Thomas, Siddabathula, Mahesh
Published in IEEE transactions on device and materials reliability (01.09.2022)
Published in IEEE transactions on device and materials reliability (01.09.2022)
Get full text
Magazine Article