Effectiveness of different approaches to mass delivery of praziquantel among school-aged children in rural communities in Nigeria
Mafe, M.A., Appelt, B., Adewale, B., Idowu, E.T., Akinwale, O.P., Adeneye, A.K., Manafa, O.U., Sulyman, M.A., Akande, O.D., Omotola, B.D.
Published in Acta tropica (01.02.2005)
Published in Acta tropica (01.02.2005)
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Journal Article
Enhancing global health accountability through results-oriented monitoring: EC/WHO collaboration
Roura, M, Capa, E, Appelt, B, Lecompte, M, Fernandez, M, Schmets, G, Porignon, D
Published in European journal of public health (24.10.2023)
Published in European journal of public health (24.10.2023)
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Journal Article
Web Resource
Sociocultural aspects of mass delivery of praziquantel in schistosomiasis control: The Abeokuta experience
Adeneye, A.K., Akinwale, O.P., Idowu, E.T., Adewale, B., Manafa, O.U., Sulyman, M.A., Omotola, B.D., Akande, D.O., Mafe, M.A., Appelt, B.
Published in Research in social and administrative pharmacy (01.06.2007)
Published in Research in social and administrative pharmacy (01.06.2007)
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Journal Article
Height as a substitute for weight for estimating praziquantel dosage
Idowu, E T, Mafe, M A, Appelt, B, Adewale, B, Adeneye, A K, Akinwale, O P, Manafa, O U, Akande, D O
Published in World health & population (2007)
Published in World health & population (2007)
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Journal Article
Growth of CuAl intermetallic compounds in Cu and Cu(Pd) wire bonding
Lu, Y. H., Wang, Y. W., Appelt, B. K., Lai, Y. S., Kao, C. R.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Endemicity of onchocerciasis in some local government areas of Niger state
Idowu, E T, Adewale, B, Mafe, M A, Appelt, B, Bamgbose, A
Published in African journal of medicine and medical sciences (01.03.2004)
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Published in African journal of medicine and medical sciences (01.03.2004)
Journal Article
Copper wire bonding experiences from a manufacturing perspective
Appelt, B. K., Tseng, A., Yi-Shao Lai
Published in 18th European Microelectronics & Packaging Conference (01.09.2011)
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Published in 18th European Microelectronics & Packaging Conference (01.09.2011)
Conference Proceeding
Fine pitch flip chip chip scale packaging
Appelt, B. K., Chung, H., Chienfan Chen, Wang, R.
Published in 18th European Microelectronics & Packaging Conference (01.09.2011)
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Published in 18th European Microelectronics & Packaging Conference (01.09.2011)
Conference Proceeding
Thin packages enabling thin mobile products
Chen, W. T., Tseng, A., Appelt, B. K.
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)
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Conference Proceeding
Cu wire bonding knows no limit - 28 nm is qualified
Appelt, B. K., Tseng, A., Uegaki, S., Huang, L.
Published in 2012 2nd IEEE CPMT Symposium Japan (01.12.2012)
Published in 2012 2nd IEEE CPMT Symposium Japan (01.12.2012)
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Conference Proceeding
Is copper wire bonding ready for automotive applications?
Appelt, B. K., Tseng, A., Huang, L., Chen, S.
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Thin packaging - What is next?
Appelt, B. K., Tseng, A., Uegaki, S., Essig, K.
Published in 2012 2nd IEEE CPMT Symposium Japan (01.12.2012)
Published in 2012 2nd IEEE CPMT Symposium Japan (01.12.2012)
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Conference Proceeding
Fine pitch copper wire bonding introduction to high volume production
Appelt, B K, Tseng, A, Yi-Shao Lai
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
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Conference Proceeding
Copper wire bonding - A maturing technology
Appelt, B K, Tseng, A, Yi-Shao Lai, Chun-Hsiung Chen
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Embedded component substrates moving forward
Appelt, B. K., Su, B., Lee, D., Yen, U., Hung, M.
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding