Alternative manufacturing process of 3-dimensional interconnect device using thermoforming process
Zulfiqar, S., Saad, A.A., Sharif, M.F.M., Samsudin, Z., Ali, M.Y.T., Ani, F.C., Ahmad, Z., Abdullah, M.K.
Published in Microelectronics and reliability (01.12.2021)
Published in Microelectronics and reliability (01.12.2021)
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Journal Article
Stress Analysis of a Stretchable Electronic Circuit
Norhidayah, A.A., Saad, A.A., Sharif, M.F.M., Ani, F.C., Ali, M.Y.T., Ibrahim, M.S., Ahmad, Z.
Published in Procedia engineering (2017)
Published in Procedia engineering (2017)
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Journal Article
Influence of printed circuit board thickness in wave soldering
Aziz, M S Abdul, Abdullah, M Z, Khor, C Y, Azid, I A, Jalar, A, Ani, F Che
Published in Scientia Iranica. Transaction B, Mechanical engineering (01.11.2017)
Published in Scientia Iranica. Transaction B, Mechanical engineering (01.11.2017)
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Journal Article
A Study on a Stretchable Conductive Polymer of Thermoplastic Automotive Device
Sharif, M.F.M., Saad, A.A., Abdullah, M.K., Aziz, N.A., Ismail, N.A., Ani, F.C., Ali, M.Y.T., Samsudin, Z.
Published in 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) (01.09.2018)
Published in 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) (01.09.2018)
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