by Huang, Junfeng, Yung, Kam Chuen, Ang, Desmond T. C.
Published in Journal of materials science. Materials in electronics (01.06.2019)

by Lin, W.H., Pey, K.L., Dong, Z., Choi, S.Y.-M., Zhou, M.S., Ang, T.C., Ang, C.H., Lau, W.S., Ye, J.H.
Published in IEEE electron device letters (01.03.2002)

by Hao, Hong, Ang, T.C, Shen, Jay
Published in Building and environment (01.04.2001)

by Kok, W. H., Yung, Winco K. C., Ang, Desmond T. C.
Published in Journal of the Australian Ceramic Society (15.03.2019)

by Huang, Junfeng, Yung, Kam Chuen, Meng, Zhengong, Ang, Desmond T. C., Li, Guijun
Published in IEEE magnetics letters (2017)

by Lin, W.H., Pey, K.L., Dong, Z., Choi, S.Y.-M., Zhou, M.S., Ang, T.C., Ang, C.H., Lau, W.S., Ye, J.H.
Published in IEEE electron device letters (01.03.2002)

by Huang, Junfeng, Yung, Winco K.C., Meng, Zhengong, Ang, Desmond T.C., Choy, Hang Shan, Li, Guijun
Published in 2016 International Conference of Asian Union of Magnetics Societies (ICAUMS) (01.08.2016)

by Chen, Z., Lin, K.M., Kuo, C.C., Lin, Y.F., Huang, J.C., Su, T.C., Wang, J.P., Liao, C.C., Han, Q.H., Bei, D.H., Ang, T.C., Jeng, M.C.
Published in Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004 (2004)

by Ong, G. K. S., Cheng, C. J. C., Ang, S. T. C., Ng, H. N., Chee, H. L.
Published in Acta anaesthesiologica Scandinavica (01.09.2003)