Radiographic technique and brackets affect measurements of proximal enamel thickness on mandibular incisors
Ang, Amy Giok Phing, Steegmans, Pauline Antoinette Josephine, Kerdijk, Wouter, Livas, Christos, Ren, Yijin
Published in European journal of orthodontics (01.02.2017)
Published in European journal of orthodontics (01.02.2017)
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Journal Article
Die Pad Delamination on QFN Package
Chiew, Chong Chee, Samsun, Paing, Vigneswaran, Letcheemana, Ang, Amy
Published in 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) (01.09.2018)
Published in 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) (01.09.2018)
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Conference Proceeding
Alternative solution for non stick on pad on gold coated palladium bond pad
Amy, A., Ying, L. C., Xavier, A.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Die attach capability on ultra thin wafer thickness for power semiconductor
Abdullah, Z., Vigneswaran, L., Ang, A., Goh Zhi Yuan
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
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Conference Proceeding
SINGAPORE PROVIDES NEW TAX INCENTIVES FOR THE FUNDS INDUSTRY
Tea, Desmond, Siang, Chong Lee, Ang, Amy
Published in Journal of International Taxation (01.08.2009)
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Published in Journal of International Taxation (01.08.2009)
Trade Publication Article