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Published in Nature (London) (03.05.2001)
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ADVANCED HANDLER WAFER DEBONDING METHOD
ANDRY PAUL S, KNICKERBOCKER JOHN U, TRZCINSKI ROBERT E, BUDD RUSSELL A, LA TULIPE JR. DOUGLAS C
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Year of Publication 10.06.2015
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OPTIMIZED ANNULAR COPPER TSV
ANDRY PAUL S, IYER SUBRAMANIAN S, VOLANT RICHARD P, KINSER EMILY R, HANNON ROBERT, TSANG CORNELIA K, FAROOQ MUKTA G
Year of Publication 05.02.2014
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Year of Publication 05.02.2014
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Published in IBM journal of research and development (01.11.2008)
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ANDRY PAUL S, KNICKERBOCKER JOHN U, KATOPSIS GEORGE A, TSAPEPAS STELIOS G, WEBB BUCKNELL C, BUCHWALTER STEPHEN L
Year of Publication 08.11.2010
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Year of Publication 08.11.2010
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3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections
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Published in IBM journal of research and development (01.11.2008)
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Fabrication and characterization of robust through-silicon vias for silicon-carrier applications
Andry, P S, Tsang, C K, Webb, B C, Sprogis, E J, Wright, S L, Dang, B, Manzer, D G
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
Knickerbocker, J. U., Andry, P. S., Buchwalter, L. P., Deutsch, A., Horton, R. R., Jenkins, K. A., Kwark, Y. H., McVicker, G., Patel, C. S., Polastre, R. J., Schuster, C. D., Sharma, A., Sri-Jayantha, S. M., Surovic, C. W., Tsang, C. K., Webb, B. C., Wright, S. L., McKnight, S. R., Sprogis, E. J., Dang, B.
Published in IBM journal of research and development (01.07.2005)
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Kuan-Neng Chen, Sang Hwui Lee, Andry, P.S., Tsang, C.K., Topol, A.W., Yu-Ming Lin, Jian-Qiang Lu, Young, A.M., Meikei Ieong, Haensch, W.
Published in 2006 International Electron Devices Meeting (2006)
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Conference Proceeding
3D chip stacking with C4 technology
Dang, B, Wright, S L, Andry, P S, Sprogis, E J, Tsang, C K, Interrante, M J, Webb, B C, Polastre, R J, Horton, R R, Patel, C S, Sharma, A, Zheng, J, Sakuma, K, Knickerbocker, J U
Published in IBM journal of research and development (01.11.2008)
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Kastberg, Russell, Farooq, Mukta Ghate, Sakuma, Katsuyuki, Andry, Paul S
Year of Publication 22.02.2024
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Assembly of a chip to a substrate
Kastberg, Russell, Farooq, Mukta Ghate, Sakuma, Katsuyuki, Andry, Paul S
Year of Publication 21.11.2023
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ASSEMBLY OF A CHIP TO A SUBSTRATE
Kastberg, Russell, Farooq, Mukta Ghate, Sakuma, Katsuyuki, Andry, Paul S
Year of Publication 30.06.2022
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