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Published in Langmuir (08.07.2003)
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Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2021)
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Knickerbocker, J U, Andry, P S, Dang, B, Horton, R R, Interrante, M J, Patel, C S, Polastre, R J, Sakuma, K, Sirdeshmukh, R, Sprogis, E J, Sri-Jayantha, S M, Stephens, A M, Topol, A W, Tsang, C K, Webb, B C, Wright, S L
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Published in IBM journal of research and development (01.11.2008)
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Andry, P S, Tsang, C K, Webb, B C, Sprogis, E J, Wright, S L, Dang, B, Manzer, D G
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Knickerbocker, J. U., Andry, P. S., Buchwalter, L. P., Deutsch, A., Horton, R. R., Jenkins, K. A., Kwark, Y. H., McVicker, G., Patel, C. S., Polastre, R. J., Schuster, C. D., Sharma, A., Sri-Jayantha, S. M., Surovic, C. W., Tsang, C. K., Webb, B. C., Wright, S. L., McKnight, S. R., Sprogis, E. J., Dang, B.
Published in IBM journal of research and development (01.07.2005)
Published in IBM journal of research and development (01.07.2005)
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Published in IEEE electron device letters (01.12.2010)
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Published in 2015 Symposium on VLSI Technology (VLSI Technology) (01.06.2015)
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Published in 2006 International Electron Devices Meeting (2006)
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