WZB117 (2-Fluoro-6-(m-hydroxybenzoyloxy) Phenyl m-Hydroxybenzoate) Inhibits GLUT1-mediated Sugar Transport by Binding Reversibly at the Exofacial Sugar Binding Site
Ojelabi, Ogooluwa A., Lloyd, Kenneth P., Simon, Andrew H., De Zutter, Julie K., Carruthers, Anthony
Published in The Journal of biological chemistry (23.12.2016)
Published in The Journal of biological chemistry (23.12.2016)
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Journal Article
Non-Contact, Sub-Surface Detection of Alloy Segregation in Back-End of Line Copper Dual-Damascene Structures
Nag, Joyeeta, Ray, Shishir, Kohli, Kriteshwar K., Simon, Andrew H., Cohen, Brian A., Tijiwa-Birk, Felipe, Parks, Christopher J., Krishnan, Siddarth A.
Published in IEEE transactions on semiconductor manufacturing (01.11.2015)
Published in IEEE transactions on semiconductor manufacturing (01.11.2015)
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Journal Article
ALD TaN Barrier for Enhanced Performance with Low Contact Resistance for 14nm Technology Node Cu Interconnects
Nag, Joyeeta, Cohen, Brian, Choi, Samuel, Ogino, Atsushi, Oh, Minseok, Yan, Yan, Liang, Jim, Christiansen, Cathryn, Kim, Andrew, Li, Baozhen, DeHaven, Patrick, Madan, Anita, Krishnan, Siddarth, Simon, Andrew H
Published in ECS transactions (10.09.2015)
Published in ECS transactions (10.09.2015)
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Journal Article
Sputter Processing
Seshan Krishna
Published in Handbook of Thin Film Deposition - Techniques, Processes, and Technologies (2012)
Published in Handbook of Thin Film Deposition - Techniques, Processes, and Technologies (2012)
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Book Chapter
Subtractive etch interconnects
Simon, Andrew H, Filippi, Ronald G, Choi, Samuel S, Lustig, Naftali E, Bao, Junjing, Bonilla, Griselda
Year of Publication 08.01.2019
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Year of Publication 08.01.2019
Patent
Insulating a via in a semiconductor substrate
Simon, Andrew H, Oakley, Jennifer A, Petrarca, Kevin S, Reardon, Nicole R, Farooq, Mukta G
Year of Publication 18.09.2018
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Year of Publication 18.09.2018
Patent
INTERCONNECT STRUCTURE FOR INTEGRATED CIRCUITS HAVING IMPROVED ELECTROMIGRATION CHARACTERISTICS AND METHOD OF MAKING SUCH STRUCTURE
GRUNOW, Stephan, SIMON, Andrew, H, STANDAERT, Theodorus, SANKARAN, Sujatha, CHANDRA, Kaushik, FILIPPI, Ronald, HU, Chao-Kun
Year of Publication 08.05.2019
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Year of Publication 08.05.2019
Patent
Interconnect structure having subtractive etch feature and damascene feature
Simon, Andrew H, Filippi, Ronald G, Choi, Samuel S, Huang, Elbert E, Lustig, Naftali E, Bonilla, Griselda
Year of Publication 09.04.2019
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Year of Publication 09.04.2019
Patent
Stacked via structure for metal fuse applications
Grunow, Stephan, Simon, Andrew H, Filippi, Ronald G, Lustig, Naftali E, Chanda, Kaushik, Bonilla, Griselda, Wang, Ping-Chuan
Year of Publication 12.03.2019
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Year of Publication 12.03.2019
Patent
Forming air gap
Simon, Andrew H, Filippi, Ronald G, Choi, Samuel S, Huang, Elbert E, Lustig, Naftali E, Bonilla, Griselda
Year of Publication 05.03.2019
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Year of Publication 05.03.2019
Patent
Detecting a void between a via and a wiring line
Simon, Andrew H, Filippi, Ronald G, Huang, Elbert E, Lustig, Naftali E, Bonilla, Griselda, Choi, Samuel S. S
Year of Publication 16.10.2018
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Year of Publication 16.10.2018
Patent
Phase change memory cell with projected liner
BAO RUQIANG, BUSSALAY PHILIPPE, SAULNIER NICOLAS, SARRAF IBRAHIM R, ANDREW H. SIMON, BURI KATHARINA, YU RENZUO
Year of Publication 08.08.2023
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Year of Publication 08.08.2023
Patent
INSULATING A VIA IN A SEMICONDUCTOR SUBSTRATE
SIMON ANDREW H, REARDON NICOLE R, PETRARCA KEVIN S, OAKLEY JENNIFER A, FAROOQ MUKTA G
Year of Publication 07.09.2017
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Year of Publication 07.09.2017
Patent