Defunctionalization of Ester-Substituted Electrochromic Dioxythiophene Polymers
Reeves, Benjamin D, Unur, Ece, Ananthakrishnan, Nisha, Reynolds, John R
Published in Macromolecules (24.07.2007)
Published in Macromolecules (24.07.2007)
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Journal Article
Photovoltaic Cells Based on Sequentially Adsorbed Multilayers of Conjugated Poly(p-phenylene ethynylene)s and a Water-Soluble Fullerene Derivative
Mwaura, Jeremiah K, Pinto, Mauricio R, Witker, David, Ananthakrishnan, Nisha, Schanze, Kirk S, Reynolds, John R
Published in Langmuir (25.10.2005)
Published in Langmuir (25.10.2005)
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Journal Article
2 재료 하이 K 열 봉지재 시스템
NAGARAJAN SIVAKUMAR, BOZORG GRAYELI ELAH, ANANTHAKRISHNAN NISHA, CHU KUANG HAN, WANG LIWEI, MCMAHAN VENMATHY, EITAN AMRAM, WEINMAN CRAIG J, MALLIK AMRITA
Year of Publication 20.02.2018
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Year of Publication 20.02.2018
Patent
p-OXA-X: A new Oligo photosensitizer for organic solar cells
Kim, Young-Gi, Christian-Pandya, Hermona, Ananthakrishnan, Nisha, Niazimbetova, Zukhra I., Thompson, Barry C., Galvin, Mary E., Reynolds, John R.
Published in Solar energy materials and solar cells (01.03.2008)
Published in Solar energy materials and solar cells (01.03.2008)
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Journal Article
Understanding Underfill Degradation in Reliability Testing Conditions for ADAS Package Development
Ziyin Lin, Subramanian, Vijay, Malatkar, Pramod, Ananthakrishnan, Nisha
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
HYBRID INTEGRATION OF BACK-END-OF-LINE LAYERS FOR DISAGGREGATED TECHNOLOGIES
Nagarajan, Sivakumar, Shaw, Santosh, Gao, Wei, Akkinepally, Praneeth Kumar, Ananthakrishnan, Nisha
Year of Publication 04.07.2024
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Year of Publication 04.07.2024
Patent
Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control
Brun, Xavier F, Liang, Yawei, Patel, Jigneshkumar P, Wang, Liwei, Mistry, Kaizad, Ananthakrishnan, Nisha, Start, Paul R, Agraharam, Sairam
Year of Publication 31.10.2023
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Year of Publication 31.10.2023
Patent
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE
ANANTHAKRISHNAN, Nisha, NOFEN, Elizabeth, EITAN, Amram, ROSS, Nick, DECKER, John C, LI, Hsin-Yu, NICKERSON, Robert M, GUO, Yang, GOKHALE, Shripad, MUTHUR SRINATH, Purushotham Kaushik
Year of Publication 18.04.2024
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Year of Publication 18.04.2024
Patent
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE
ANANTHAKRISHNAN, Nisha, NOFEN, Elizabeth, EITAN, Amram, ROSS, Nick, DECKER, John C, LI, Hsin-Yu, NICKERSON, Robert M, GUO, Yang, GOKHALE, Shripad, MUTHUR SRINATH, Purushotham Kaushik
Year of Publication 18.01.2024
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Year of Publication 18.01.2024
Patent