by Muthana, P., Srinivasan, K., Engin, A.E., Swaminathan, M., Tummala, R., Sundaram, V., Wiedenman, B., Amey, D.I., Dietz, K.H., Banerji, S.
Published in IEEE transactions on advanced packaging (01.05.2008)

by Amey, D.I., Horowitz, S.J., Keusseyan, R.L.
Published in Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) (1998)

by Amey, D.I., Horowitz, S.J.
Published in IEMT/IMC Symposium, 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference] (1997)

by Page, J., Amey, D.I., Draudt, R., Inman, M., Horowitz, S.J.
Published in Proceedings 1997 International Conference on Multichip Modules (1997)

by Amey, D.I., Horowitz, S.J.
Published in Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (1997)

by Balde, J.W., Amey, D.I.
Published in Computer (Long Beach, Calif.) (01.12.1977)

by Amey, D.I., Curilla, J.P.
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)

by Keusseyan, R.L., Amey, D.I., Horowitz, S.J.
Published in Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) (1998)

by Donahue, P.C., Taylor, B.E., Amey, D.I., Draudt, R.R., Smith, M.A., Horowitz, S.J., Larry, J.R.
Published in Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) (1998)

by Ladd, S.K., Mandry, J.E., Horowitz, S.J., Amey, D.I., Page, J.P., Holmes, D.
Published in Proceedings 1997 International Conference on Multichip Modules (1997)