Room temperature bonding of aluminum nitride ceramic and semiconductor substrate
Matsumae, Takashi, Kurashima, Yuichi, Higurashi, Eiji, Nishizono, Kazunori, Amano, Tsutomu, Takagi, Hideki
Published in Ceramics international (01.11.2020)
Published in Ceramics international (01.11.2020)
Get full text
Journal Article
Room-Temperature bonding of AlN ceramic and Si semiconductor substrates for improved thermal management
Matsumae, Takashi, Kurashima, Yuichi, Takagi, Hideki, Nishizono, Kazunori, Amano, Tsutomu, Higurashi, Eiji
Published in 2021 International Conference on Electronics Packaging (ICEP) (12.05.2021)
Published in 2021 International Conference on Electronics Packaging (ICEP) (12.05.2021)
Get full text
Conference Proceeding
OUTER BOX FOR HOUSING INNER BAG FOR BAG-IN-BOX, AND BAG-IN-BOX
AMANO, TSUTOMU, HIRAISHI, KAZUHIRO, ODA, ASAMI, MORIGUCHI, TOSHIYA, FUJIMOTO, YUKO, SUGIURA, YUKO
Year of Publication 23.12.2009
Get full text
Year of Publication 23.12.2009
Patent