High‐Temperature Oxidation‐Resistant Printed Copper Conductors
Khuje, Saurabh, Alshatnawi, Firas, Alhendi, Mohammed, Yu, Jian, Sheng, Aaron, Huang, Yulong, Zhuang, Cheng‐Gang, Armstrong, Jason, Zhou, Chi, Poliks, Mark, Ren, Shenqiang
Published in Advanced electronic materials (01.03.2023)
Published in Advanced electronic materials (01.03.2023)
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Journal Article
Additive Manufacturing of High‐Temperature Hybrid Electronics via Molecular‐Decomposed Metals
Khuje, Saurabh, Alshatnawi, Firas, Smilgies, Detlef, Alhendi, Mohammed, Islam, Abdullah, Armstrong, Jason, Yu, Jian, Poliks, Mark, Ren, Shenqiang
Published in Advanced functional materials (01.01.2024)
Published in Advanced functional materials (01.01.2024)
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Journal Article
Electrical and Mechanical Behavior of Aerosol Jet–Printed Gold on Alumina Substrate for High‐Temperature Applications
Alshatnawi, Firas, Alhendi, Mohammed, Abbara, El Mehdi, Sivasubramony, Rajesh, Garakani, Behnam, Enakerakpo, Emuobosan, Shaddock, David, Stoffel, Nancy, Hoel, Cathleen, Poliks, Mark D., Borgesen, Peter
Published in Advanced engineering materials (01.10.2023)
Published in Advanced engineering materials (01.10.2023)
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Journal Article
Printed electronics for extreme high temperature environments
Alhendi, Mohammed, Alshatnawi, Firas, Abbara, El Mehdi, Sivasubramony, Rajesh, Khinda, Gurvinder, Umar, Ashraf I., Borgesen, Peter, Poliks, Mark D., Shaddock, David, Hoel, Cathleen, Stoffel, Nancy, Lam, Tommyhing-K.H.
Published in Additive manufacturing (01.06.2022)
Published in Additive manufacturing (01.06.2022)
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Journal Article
High stability and reliability additively manufactured metal-insulator-metal capacitors for high-temperature applications
Alshatnawi, Firas, Enakerakpo, Emuobosan, Alhendi, Mohammed, Abdelatty, Mohamed, Umar, Ashraf, Al-Haidari, Riadh, Shaddock, David, Hoel, Cathleen, Boyd, Linda, Poliks, Mark, Borgesen, Peter
Published in Materials today communications (01.06.2024)
Published in Materials today communications (01.06.2024)
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Journal Article
Novel SiO2 Cables With Edge Launch Connectors for High Temperature RF Measurements
Alshatnawi, Firas, Umar, Ashraf, Enakerakpo, Emuobosan, Abdelatty, Mohamed Youssef, Alshaibani, WT, Al-Haidari, Riadh, Alhendi, Mohammed, Shaddock, David, Borgesen, Peter, Poliks, Mark D.
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Modeling and Additive Manufacturing of Inductors in Complex Geometries for High Temperature Electronics
Alshaibani, WT, Umar, Ashraf, Alshatnawi, Firas, Enakerakpo, Emuobosan, Abdelatty, Mohamed Youssef, Shaddock, David, Alhendi, Mohammed, Hoel, Cathleen, Poliks, Mark D.
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Current Carrying Capacity of Inkjet-Printed Nano-Silver Interconnects on Mesoporous PET Substrate
Abbara, El Mehdi, Khinda, Gurvinder Singh, Alhendi, Mohammed, Alhaidari, Riadh, Alshatnawi, Firas, Garakani, Behnam, Somarathna, Udara S., Poliks, Mark D.
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Embedded RF Packaging Via Ceramic 3D Printing and Printed Electronics Additive Manufacturing
Obeidat, Abdullah S., Umar, Ashraf, Dou, Zhi, Alshatnawi, Firas, Al-Haidari, Riadh, Al-Shaibani, Waleed, Alhendi, Mohammed, Abdelatty, Mohamed Y., Boyd, Linda, Hoel, Cathleen, Valle Angulo, Genaro Soto, Budka, Thomas, Case, Jason, Iannotti, Joseph, Pavinatto, Felippe, Poliks, Mark D.
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
High Temperature Die Interconnection Approaches
Alshatnawi, Firas, Alhendi, Mohammed, Al-Haidari, Riadh A., Sivasubramony, Rajesh S., Abbara, El Mehdi, Udara Somarathna, K, Poliks, Mark D., Borgesen, Peter, Shaddock, David M., Stoffel, Nancy, Hoel, Cathleen
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding