Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers
Heitmann, S., Hütten, A., Hempel, T., Schepper, W., Reiss, G., Alof, C.
Published in Journal of applied physics (01.05.2000)
Published in Journal of applied physics (01.05.2000)
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Journal Article
Structural evolution of SnO2-TiO2 nanocrystalline films for gas sensors
EDELMAN, F, HAHN, H, CHACK, A, MIKHELASHVILI, V, EISENSTEIN, G, SEIFRIED, S, ALOF, C, HOCHE, H, BALOGH, A, WERNER, P, ZAKRZEWSKA, K, RADECKA, M, PASIERB, P
Published in Materials science & engineering. B, Solid-state materials for advanced technology (19.01.2000)
Published in Materials science & engineering. B, Solid-state materials for advanced technology (19.01.2000)
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Conference Proceeding
Journal Article
A 0.18 /spl mu/m logic-based MRAM technology for high performance nonvolatile memory applications
Sitaram, A.R., Abraham, D.W., Alof, C., Braun, D., Brown, S., Costrini, G., Findeis, F., Gaidis, M., Galligan, E., Glashauser, W., Gupta, A., Hoenigschmid, H., Hummel, J., Kanakasabapathy, S., Kasko, I., Kim, W., Klostermann, U., Lee, G.Y., Leuschner, R., Low, K.-S., Lu, Y., Nutzel, J., O'Sullivan, E., Park, C., Raberg, W., Robertazzi, R., Sarma, C., Schmid, J., Trouilloud, P.L., Worledge, D., Wright, G., Gallagher, W.J., Muller, G.
Published in 2003 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.03CH37407) (2003)
Published in 2003 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.03CH37407) (2003)
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Conference Proceeding