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Wireless semiconductor package for efficient heat dissipation
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Year of Publication 08.09.2009
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WIRELESS SEMICONDUCTOR PACKAGE FOR EFFICIENT HEAT DISSIPATION
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Year of Publication 16.04.2009
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Wireless semiconductor package for efficient heat dissipation
SON, JOONSEO, MALDO, TIBURCIO A, ALMAGRO, ERWIN IAN V, RIOS, MARGIE T, CALO, PAUL ARMAND
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Year of Publication 21.01.2015
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An effective method for improving IC package die failure during assembly punch processing
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Published in EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005 (2005)
Published in EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005 (2005)
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Conference Proceeding
Wireless semiconductor package for efficient heat dissipation
CALO PAUL ARMAND A, SON JOONSEO, MALDO TIBURCIO A, ALMAGRO ERWIN IAN V, RIOS MARGIE T
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Year of Publication 01.09.2010
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Wireless semiconductor package for efficient heat dissipation
MALDO, TIBURCIO A, ALMAGRO, ERWIN IAN V, SON, JOON-SEO, RIOS, MARGIE T, CALO, PAUL ARMAND
Year of Publication 16.08.2009
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Year of Publication 16.08.2009
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