Stack Bonding Technique Using Heavy Aluminum Ribbon Wires
Almagro, E.I.V., Granada, H.T.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
An effective method for improving IC package die failure during assembly punch processing
Irving, S., Liu, Y., Almagro, E.I.V., Granada, H.T.
Published in EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005 (2005)
Published in EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005 (2005)
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Conference Proceeding