High Performance MEMS IMU with ThELMA-Double Technology
Gattere, G., Rizzini, F., Guerinoni, L., Falorni, L., Valzasina, C., Vercesi, F., Corso, L., Allegato, G.
Published in 2022 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL) (08.05.2022)
Published in 2022 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL) (08.05.2022)
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Conference Proceeding
A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks
Ruffieux, D., Scolari, N., Giroud, F., Le, T. C., Piazza, S. D., Staub, F., Zoschke, K., Manier, C. A., Oppermann, H., Dekker, J., Suni, T., Allegato, G.
Published in 2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers (01.02.2013)
Published in 2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers (01.02.2013)
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Conference Proceeding
A multi-scale approach to wafer to wafer metallic bonding in MEMS
Ghisi, A., Corigliano, A., Mariani, S., Allegato, G.
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)
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Conference Proceeding
Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices
Zoschke, K., Manier, C.-A, Wilke, M., Oppermann, H., Ruffieux, D., Dekker, J., Jaakkola, A., Dalla Piazza, S., Allegato, G., Lang, K.-D
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies
Zoschke, K., Manier, C.-A, Wilke, M., Jurgensen, N., Oppermann, H., Ruffieux, D., Dekker, J., Heikkinen, Hannele, Dalla Piazza, S., Allegato, G., Lang, K.-D
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Vacuum packaging at wafer level for MEMS using gold-tin metallurgy
Manier, C-A, Zoschke, K., Oppermann, H., Ruffieux, D., Dalla Piazza, S., Suni, T., Dekker, J., Allegato, G.
Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
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Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
Conference Proceeding
Investigation of key technologies for System-in-Package integration of inertial MEMS
Marenco, N., Reinert, W., Warnat, S., Lange, P., Gruenzig, S., Allegato, G., Hillmann, G., Kostner, H., Gal, W., Guadagnuolo, S., Conte, A., Malecki, K., Friedel, K.
Published in 2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (01.04.2009)
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Published in 2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (01.04.2009)
Conference Proceeding