5G-enabled, battery-less smart skins for self-monitoring megastructures and digital twin applications
Lynch, Charles, Adeyeye, Ajibayo, Abbara, El Mehdi, Umar, Ashraf, Alhendi, Mohammed, Minnella, Chris, Iannotti, Joseph, Stoffel, Nancy, Poliks, Mark, Tentzeris, Manos M.
Published in Scientific reports (01.05.2024)
Published in Scientific reports (01.05.2024)
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Journal Article
High‐Temperature Oxidation‐Resistant Printed Copper Conductors
Khuje, Saurabh, Alshatnawi, Firas, Alhendi, Mohammed, Yu, Jian, Sheng, Aaron, Huang, Yulong, Zhuang, Cheng‐Gang, Armstrong, Jason, Zhou, Chi, Poliks, Mark, Ren, Shenqiang
Published in Advanced electronic materials (01.03.2023)
Published in Advanced electronic materials (01.03.2023)
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Journal Article
Performance Evaluation of RF Novel Microstrip Lines Printed on Flexible Substrates
Obeidat, Abdullah S., Alhendi, Mohammed, Abdelatty, Mohamed Y., Umar, Ashraf, Enakerakpo, Emuobosan, Al-Haidari, Riadh, Poliks, Mark D.
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)
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Conference Proceeding
Additive Manufacturing of High‐Temperature Hybrid Electronics via Molecular‐Decomposed Metals
Khuje, Saurabh, Alshatnawi, Firas, Smilgies, Detlef, Alhendi, Mohammed, Islam, Abdullah, Armstrong, Jason, Yu, Jian, Poliks, Mark, Ren, Shenqiang
Published in Advanced functional materials (01.01.2024)
Published in Advanced functional materials (01.01.2024)
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Journal Article
Electrical and Mechanical Behavior of Aerosol Jet–Printed Gold on Alumina Substrate for High‐Temperature Applications
Alshatnawi, Firas, Alhendi, Mohammed, Abbara, El Mehdi, Sivasubramony, Rajesh, Garakani, Behnam, Enakerakpo, Emuobosan, Shaddock, David, Stoffel, Nancy, Hoel, Cathleen, Poliks, Mark D., Borgesen, Peter
Published in Advanced engineering materials (01.10.2023)
Published in Advanced engineering materials (01.10.2023)
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Journal Article
Embedded p-i-n-Diode Die Interconnections With Aerosol-Jet Printing
Gonya, Stephen, Alhendi, Mohammed, Enakerakpo, Emuobosan, Poliks, Mark D., Rovere, Tom, Jendrisak, Joseph, Geyer, Michael, Hines, Daniel
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2024)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2024)
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Journal Article
3D printing of poly(ethylene oxide) or electrospun polystyrene microtube embedded sodium alginate and carboxymethyl cellulose hydrogel
Chen, Yan, Zhou, Yue, Abbara, El Mehdi, Alhendi, Mohammed, Poliks, Mark, Ning, Fuda, Zhou, Yingge
Published in Manufacturing letters (01.08.2023)
Published in Manufacturing letters (01.08.2023)
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Journal Article
Printed electronics for extreme high temperature environments
Alhendi, Mohammed, Alshatnawi, Firas, Abbara, El Mehdi, Sivasubramony, Rajesh, Khinda, Gurvinder, Umar, Ashraf I., Borgesen, Peter, Poliks, Mark D., Shaddock, David, Hoel, Cathleen, Stoffel, Nancy, Lam, Tommyhing-K.H.
Published in Additive manufacturing (01.06.2022)
Published in Additive manufacturing (01.06.2022)
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Journal Article
SiC Power Module Packaging Using Printed Electronics Materials and Processes
Al-Haidari, Riadh, Richmond, Dylan, Obeidat, Abdullah, Alhendi, Mohammed, Abbara, El Mehdi, Somarathna, Udara S., Poliks, Mark, Gowda, Arun V., Erlbaum, Jeff, Xiong, Han, Hitchcock, Collin
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (04.09.2024)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (04.09.2024)
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Journal Article
Effect of Thermal and Mechanical Stresses on Novel Microstrip Lines Printed on Flexible Substrates
Obeidat, Abdullah S., Enakerakpo, Emuobosan, Umar, Ashraf, Al-Shaibani, Waleed, Abdelatty, Mohamed, Lieberman, Sara, Noruz Shamsian, Olya, Al-Haidari, Riadh, Alhendi, Mohammed, Poliks, Mark D.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2024)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2024)
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Journal Article
Effect of substrate properties on isothermal fatigue of aerosol jet printed nano-Ag traces on flex
Muralidharan, Roshan, Raj, Arun, Sivasubramony, Rajesh Sharma, Yadav, Manu, Alhendi, Mohammed, Nilsson, Matthew, Greene, Christopher, Poliks, Mark D., Borgesen, Peter
Published in Journal of materials research (28.08.2019)
Published in Journal of materials research (28.08.2019)
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Journal Article
Empirical Model and Experimental Validation of Meshed Ground Impact on RF Performance of Flexible Microstrip Lines for Bending Applications
Abdelatty, Mohamed Y., Alhendi, Mohammed, Obeidat, Abdullah S., Umar, Ashraf, Enakerakpo, Emuobosan, Al-Haidari, Riadh, Poliks, Mark D.
Published in IEEE journal on flexible electronics (27.05.2024)
Published in IEEE journal on flexible electronics (27.05.2024)
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Journal Article
High stability and reliability additively manufactured metal-insulator-metal capacitors for high-temperature applications
Alshatnawi, Firas, Enakerakpo, Emuobosan, Alhendi, Mohammed, Abdelatty, Mohamed, Umar, Ashraf, Al-Haidari, Riadh, Shaddock, David, Hoel, Cathleen, Boyd, Linda, Poliks, Mark, Borgesen, Peter
Published in Materials today communications (01.06.2024)
Published in Materials today communications (01.06.2024)
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Journal Article
Fatigue behaviour of inkjet-printed silver interconnects on silica-coated mesoporous flexible PET substrate
Khinda, Gurvinder Singh, Kokash, Maan Z, Alhendi, Mohammed, Garakani, Behnam, Stoffel, Nancy C, Borgesen, Peter, Poliks, Mark D
Published in Flexible and printed electronics (01.03.2022)
Published in Flexible and printed electronics (01.03.2022)
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Journal Article
Effects of Strain Rate and Dwell Time on Fatigue Damage Accumulation in Aerosol Jet Printed Nanosilver Traces on Flex
Raj, Arun, Yadav, Manu, Adams, Nardeeka S., Sivasubramony, Rajesh S., Alhendi, Mohammed, Poliks, Mark, Borgesen, Peter
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2020)
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Journal Article
Passive UHF-RFID Tag With Printed Security Features for Authentication and Tamper Resistance
Enakerakpo, Emuobosan, Umar, Ashraf, Alhendi, Mohammed, Al-Haidari, Riadh, Richmond, Dylan J., Somarathna, Udara Sandakelum, Gonya, Stephen, Poliks, Mark D., Rovere, Tom, Beckford, Matthew, Nichols, Jonathan
Published in IEEE journal of radio frequency identification (Online) (2024)
Published in IEEE journal of radio frequency identification (Online) (2024)
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Journal Article
Precision Dispensed Die Fillets as Nonconformal Surfaces for Printed Interconnects: Characterization, Optimization, and Mechanical Performance Assessment
Cestarollo, Ludovico, Alhendi, Mohammed, Sivasubramony, Rajesh Sharma, Khinda, Gurvinder Singh, Weerawarne, Darshana L., Borgesen, Peter, Poliks, Mark D., Stoffel, Nancy C., Iannotti, Joe
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2021)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2021)
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Journal Article
The role of surface roughness on the electrical behavior of flexible and stretchable screen-printed silver ink on Kapton substrate
Abdelatty, Mohamed Y, Umar, Ashraf, Khinda, Gurvinder S, Cadwell, Ryan J, Levy, Joshua A, Huang, Nancy, Weerawarne, Darshana L, Alhendi, Mohammed, Miller, Scott M, Poliks, Mark D
Published in Flexible and printed electronics (01.12.2023)
Published in Flexible and printed electronics (01.12.2023)
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Journal Article