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"Alcoe, David J"
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"Alcoe, David J"
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COMPLIANT LAMINATE CONNECTOR BACKGROUND OF THE INVENTION
by
ALCOE DAVID J
Year of Publication
23.05.2002
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Compliant laminate connector
by
ALCOE
,
DAVID J
Year of Publication
12.09.2012
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High density connector for interconnecting fine pitch circuit packaging structures
by
Chan, Benson
,
Alcoe
,
David J
Year of Publication
05.07.2011
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High density connector for interconnecting fine pitch circuit packaging structures
by
ALCOE DAVID J
,
CHAN BENSON
Year of Publication
05.07.2011
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HIGH DENSITY CONNECTOR FOR INTERCONNECTING FINE PITCH CIRCUIT PACKAGING STRUCTURES
by
ALCOE DAVID J
,
CHAN BENSON
Year of Publication
23.12.2010
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Method of reforming reformable members of an electronic package and the resultant electronic package
by
ALCOE DAVID J
Year of Publication
21.03.2006
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Method of reforming reformable members of an electronic package and the resultant electronic package
by
Alcoe
,
David J
Year of Publication
21.03.2006
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METHOD OF REFORMING REFORMABLE MEMBERS OF AN ELECTRONIC PACKAGE AND THE RESULTANT ELECTRONIC PACKAGE
by
ALCOE DAVID J
Year of Publication
12.01.2006
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Method of reforming reformable members of an electronic package and the resultant electronic package
by
Alcoe
,
David J
Year of Publication
27.12.2005
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Method of reforming reformable members of an electronic package and the resultant electronic package
by
ALCOE DAVID J
Year of Publication
27.12.2005
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Flexible circuit electronic package with standoffs
by
Alcoe
,
David J
,
Calmidi, Varaprasad V
Year of Publication
14.12.2010
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Flexible circuit electronic package with standoffs
by
ALCOE DAVID J
,
CALMIDI VARAPRASAD V
Year of Publication
14.12.2010
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Electronic pckage with conductive pad capable of withstanding significant loads and information handling system utilizing same
by
ALCOE DAVID J
Year of Publication
02.12.2004
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Compliant laminate connector
by
ALCOE DAVID J
Year of Publication
09.11.2004
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Compliant laminate connector
by
Alcoe
,
David J
Year of Publication
09.11.2004
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Adjustable thickness thermal interposer and electronic package utilizing same
by
ALCOE DAVID J
,
CALMIDI VARAPRASAD V
Year of Publication
08.12.2009
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Adjustable thickness thermal interposer and electronic package utilizing same
by
Alcoe
,
David J
,
Calmidi, Varaprasad V
Year of Publication
08.12.2009
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Method of reforming reformable members of an electronic package and the resultant electronic package
by
ALCOE DAVID J
Year of Publication
23.10.2003
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Compliant laminate connector
by
ALCOE
,
DAVID J
Year of Publication
13.08.2003
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Method of reforming reformable members of an electronic package and the resultant electronic package
by
Alcoe
,
David J
Year of Publication
24.06.2003
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