High Temperature Die Interconnection Approaches
Alshatnawi, Firas, Alhendi, Mohammed, Al-Haidari, Riadh A., Sivasubramony, Rajesh S., Abbara, El Mehdi, Udara Somarathna, K, Poliks, Mark D., Borgesen, Peter, Shaddock, David M., Stoffel, Nancy, Hoel, Cathleen
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
The Performance and Reliability of Screen-printed Flexible Multilayer Leads for Wearable Vital Sign Monitoring Devices
Somarathna, Udara S., Garakani, Behnam, Alhendi, Mohammed, Weerawarne, Darshana L., Al-Haidari, Riadh A., Misner, Matthew J., Burns, Andrew, Khinda, Gurvinder S., Alizadeh, Azar, Poliks, Mark D.
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding