Harmonic and Random Vibration Durability of SAC305 and Sn37Pb Solder Alloys
Zhou, Y, Al-Bassyiouni, M, Dasgupta, A
Published in IEEE transactions on components and packaging technologies (01.06.2010)
Published in IEEE transactions on components and packaging technologies (01.06.2010)
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Journal Article
The effect of secondary impacts on PWB-level drop tests at high impact accelerations
Douglas, S, Meng, J, Akman, J, Yildiz, I, Al-Bassyiouni, M, Dasgupta, A
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
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Conference Proceeding
Copper trace fatigue models for mechanical cycling, vibration and shock/drop of high-density PWAs
Farley, D., Zhou, Y., Askari, F., Al-Bassyiouni, M., Dasgupta, A., Caers, J.F.J., DeVries, J.W.C.
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
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Conference Proceeding
Vibration durability of Pb-free HVQFN assemblies
Choi, C, Al-Bassyiouni, M, Dasgupta, A, de Vries, J W C, Balemans, Will, van Driel, W
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Bearing wear model for optical disk drive stepper motor
Mirbagheri, S. E., Al-Bassyiouni, M., Dasgupta, A.
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
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Conference Proceeding
Copper trace fatigue models for mechanical cycling, vibration and shock/drop of high-density PWAs : Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems (eurosime 2009)
FARLEY, D, ZHOU, Y, ASKARI, F, AL-BASSYIOUNI, M, DASGUPTA, A, CAERS, J. F. J, DEVRIES, J. W. C
Published in Microelectronics and reliability (2010)
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Published in Microelectronics and reliability (2010)
Journal Article