High density interconnection using photosensitive polyimide and electroplated copper conductor lines
Chakravorty, K.K., Chien, C.P., Cech, J.M., Branson, L.B., Atencio, J.M., White, T.M., Lathrop, L.S., Aker, B.W., Tanielian, M.H., Young, P.L.
Published in Proceedings., 39th Electronic Components Conference (1989)
Published in Proceedings., 39th Electronic Components Conference (1989)
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