Direct bonding for dissimilar metals assisted by carboxylic acid vapor
Song, Jenn-Ming, Huang, Shang-Kun, Akaike, Masatake, Suga, Tadatomo
Published in Japanese Journal of Applied Physics (01.03.2015)
Published in Japanese Journal of Applied Physics (01.03.2015)
Get full text
Journal Article
A New Combined Process of Formic Acid Pretreatment for Low-temperature Bonding of Copper Electrodes
Yang, Wenhua, Akaike, Masatake, Fujino, Masahisa, Suga, Tadatomo
Published in ECS transactions (15.03.2013)
Published in ECS transactions (15.03.2013)
Get full text
Journal Article
Low temperature de-oxidation for copper surface by catalyzed formic acid vapor
Chou, Pei-Wen, Song, Jenn-Ming, Xie, Zong-Yu, Akaike, Masatake, Suga, Tadatomo, Fujino, Masahisa, Lin, Jing-Yuan
Published in Applied surface science (31.10.2018)
Published in Applied surface science (31.10.2018)
Get full text
Journal Article
Formic acid vapor treated Cu-Cu direct bonding at low temperature
Wenhua Yang, Shintani, H., Akaike, M., Suga, T.
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
Get full text
Conference Proceeding
Cold Pressure Welding of Metals in Ultra-high Vacuum
Akaike, Masatake, Funakubo, Hiroyasu
Published in Bulletin of the Japan Institute of Metals (20.10.1982)
Published in Bulletin of the Japan Institute of Metals (20.10.1982)
Get full text
Journal Article
Low temperature all-Cu bonding via Cu-nanoparticle paste sintering in Pt-catalyzed formic acid vapor
Mu, Fengwen, Ren, Hui, Shin, Seongbin, Masatake, Akaike, Liu, Lei, Zou, Guisheng, Makoto, Yoshida, Suga, Tadatomo
Published in 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (01.05.2019)
Published in 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (01.05.2019)
Get full text
Conference Proceeding
Process parameters for formic acid treatment with Pt catalyst for Cu direct bonding
Matsuoka, Naoya, Fujino, Masahisa, Akaike, Masatake, Suga, Tadatomo
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
Get full text
Conference Proceeding
Cu/Adhesive Hybrid Bonding at 180 °C in H-Containing HCOOH Vapor Ambient for 2.5D/3D Integration
Ran He, Fujino, Masahisa, Akaike, Masatake, Suga, Tadatomo, Sakai, Taiji, Sakuyama, Seiki
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Get full text
Conference Proceeding
Cu/adhesive hybrid bonding through a Cu-first bonding approach by using H-containing HCOOH vapor surface treatment
Ran He, Fujino, Masahisa, Akaike, Masatake, Suga, Tadatomo, Sakai, Taiji, Sakuyama, Seiki
Published in 2017 18th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2017)
Published in 2017 18th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2017)
Get full text
Conference Proceeding