Electroless Deposited Cobalt-Tungsten-Boron Capping Barrier Metal on Damascene Copper Interconnection
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Published in Journal of the Electrochemical Society (01.01.2005)
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Improving Impact Toughness of BGA Lead-Free Solder Joints by Using Higher Current Density in Electrolytic Ni Plating
Yamamoto, K, Kawamura, T, Nakano, H, Akahoshi, H, Satoh, R
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2011)
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Filling profiles simulations for copper electroplating process
Sano, A, Kobayashi, K, Akahoshi, H, Itabashi, T, Haba, T, Fukada, S, Miyazaki, H
Published in Hyōmen gijutsu (01.01.2001)
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Published in Hyōmen gijutsu (01.01.2001)
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Differences in prognostic factors according to viral status in patients with hepatocellular carcinoma
AKAHOSHI, Hiroshi, TAURA, Naota, OHTANI, Masashi, ISOMOTO, Hajime, MATSUMOTO, Takehiro, TAKESHIMA, Fuminao, NAKAO, Kazuhiko, ICHIKAWA, Tatsuki, MIYAAKI, Hisamitsu, AKIYAMA, Motohisa, MIUMA, Satoshi, OZAWA, Eisuke, TAKESHITA, Shigeyuki, MURAOKA, Toru, MATSUZAKI, Toshihisa
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Published in Oncology reports (01.05.2010)
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Electrochemical and spectroelectrochemical properties of polyviologen complex modified electrodes
Akahoshi, Haruo, Toshima, Shinobu, Itaya, Kingo
Published in Journal of physical chemistry (1952) (01.04.1981)
Published in Journal of physical chemistry (1952) (01.04.1981)
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Natural woody plant, Mallotus japonicus, as an ecological partner to transfer different pathotypic conidia of Oidium neolycopersici to greenhouse tomatoes
Nonomura, Teruo, Matsuda, Yoshinori, Yamashita, Shun, Akahoshi, Haruhiko, Takikawa, Yoshihiro, Kakutani, Koji, Toyoda, Hideyoshi
Published in Plant protection science (01.01.2013)
Published in Plant protection science (01.01.2013)
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Trench and via filling profile simulations for copper electroplating process
Kobayashi, K., Sano, A., Akahoshi, H., Itabashi, T., Haba, T., Fukada, S., Miyazaki, H.
Published in Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) (2000)
Published in Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) (2000)
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Conference Proceeding
Solvation states and properties of binary mixtures of halogenated cyclic carbonates and a linear carbonate
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Journal Article
Conference Proceeding
Fine line circuit manufacturing technology with electroless copper plating
Akahoshi, H., Kawamoto, M., Itabashi, T., Miura, O., Takahashi, A., Kobayashi, S., Miyazaki, M., Mutoh, T., Wajima, M., Ishimaru, T.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part A (01.03.1995)
Published in IEEE transactions on components, packaging, and manufacturing technology. Part A (01.03.1995)
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