An Efficient Process of Surface Modification and Patterning for LED Encapsulation
Moulin, G., Consonni, M., Nonglaton, G., Ait-Mani, N., Vandeneynde, A., Levy, F., Gasse, A.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2018)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2018)
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Journal Article
Experimental and modelling thermal study of a 3D-stacked silicon based LEDs array concept
Chambion, B., Bouillard, B., Gasse, A., Vandeneynde, A., Ait-Mani, N., Gueugnot, A., Henry, D., Mercier, F., Rueda, P.
Published in 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2017)
Published in 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2017)
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Conference Proceeding
A Wafer Level approach for led packaging using TSV last technology
Volpert, M., Soulier, B., Borel, S., Ait-Mani, N., Gaugiran, S., Gasse, A., Henry, D.
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding