Development of high-density interconnection techniques for contactless smart cards
Aintila, A., Sarkka, J., Kivilahti, J.K.
Published in 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) (2000)
Published in 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) (2000)
Get full text
Conference Proceeding
Towards Low Cost High Density Bumping
Aintila, A., Jarvinen, E., Lalu, S.
Published in Proceedings of Japan International Electronic Manufacturing Technology Symposium (1993)
Published in Proceedings of Japan International Electronic Manufacturing Technology Symposium (1993)
Get full text
Conference Proceeding