Fabrication of Silicon Carriers With TSV Electrical Interconnections and Embedded Thermal Solutions for High Power 3-D Packages
Aibin Yu, Khan, N., Archit, G., Pinjala, D., Kok Chuan Toh, Kripesh, V., Seung Wook Yoon, Lau, J.H.
Published in IEEE transactions on components and packaging technologies (01.09.2009)
Published in IEEE transactions on components and packaging technologies (01.09.2009)
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Journal Article
A low-profile three-dimensional neural probe array using a silicon lead transfer structure
Cheng, Ming-Yuan, Je, Minkyu, Tan, Kwan Ling, Tan, Ee Lim, Lim, Ruiqi, Yao, Lei, Li, Peng, Park, Woo-Tae, Phua, Eric Jian Rong, Gan, Chee Lip, Yu, Aibin
Published in Journal of micromechanics and microengineering (01.09.2013)
Published in Journal of micromechanics and microengineering (01.09.2013)
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Journal Article
Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications
Made, Riko I, Gan, Chee Lip, Yan, Li Ling, Yu, Aibin, Yoon, Seung Wook, Lau, John H., Lee, Chengkuo
Published in Journal of electronic materials (01.02.2009)
Published in Journal of electronic materials (01.02.2009)
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Journal Article
A flexible polyimide cable for implantable neural probe arrays
Cheng, Ming-Yuan, Park, Woo-Tae, Yu, Aibin, Xue, Rui-Feng, Tan, Kwan Ling, Yu, Daquan, Lee, Sang-Hyun, Gan, Chee Lip, Je, Minkyu
Published in Microsystem technologies : sensors, actuators, systems integration (01.08.2013)
Published in Microsystem technologies : sensors, actuators, systems integration (01.08.2013)
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Journal Article
Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects
Aibin Yu, Lau, J. H., Soon Wee Ho, Kumar, A., Wai Yin Hnin, Wen Sheng Lee, Ming Ching Jong, Sekhar, V. N., Kripesh, V., Pinjala, D., Chen, S., Chien-Feng Chan, Chun-Chieh Chao, Chi-Hsin Chiu, Chih-Ming Huang, Chen, C.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2011)
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Journal Article
A Reconfigurable Micromachined Switching Filter Using Periodic Structures
Karim, MF, Ai-Qun Liu, Alphones, A., Aibin Yu
Published in IEEE transactions on microwave theory and techniques (01.06.2007)
Published in IEEE transactions on microwave theory and techniques (01.06.2007)
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Journal Article
Development of 25-μm-Pitch Microbumps for 3-D Chip Stacking
AIBIN YU, KUMAR, Aditya, CHAN, Chien-Feng, CHAO, Chun-Chieh, CHIU, Chi-Hsin, CHAN, Chang-Yueh, CHANG, Chin-Huang, HUANG, Chih-Ming, CARL CHEN, SOON WEE HO, HNIN WAI YIN, LAU, John H, SU, Nandar, KHONG CHEE HOUE, JONG MING CHING, KRIPESH, Vaidyanathan, CHEN, Scott
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2012)
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Journal Article
Elimination of splash damage for smaller scribe widths in next-gen memory devices via stealth dicing
Lim, Dao Kun, Vempaty, Venkata Rama Satya Pradeep, Yu, Aibin, Sim, Wen How, Singh, Harjashan Veer
Published in Materials science in semiconductor processing (01.10.2024)
Published in Materials science in semiconductor processing (01.10.2024)
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Journal Article
Wideband transitions for wafer level MEMS packages
Ying Ying Lim, Aibin Yu, Bangtao Chen
Published in 2010 IEEE Electrical Design of Advanced Package & Systems Symposium (01.12.2010)
Published in 2010 IEEE Electrical Design of Advanced Package & Systems Symposium (01.12.2010)
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Conference Proceeding
Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packaging
Lee, Chengkuo, Yu, Aibin, Yan, Liling, Wang, Haitao, He, Johnny Han, Zhang, Qing Xin, Lau, John H.
Published in Sensors and actuators. A. Physical. (31.08.2009)
Published in Sensors and actuators. A. Physical. (31.08.2009)
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Journal Article
Microfabricated endoscopic probe integrated MEMS micromirror for optical coherence tomography bioimaging
Ming-Fang Wang, Yingshun Xu, Prem, C S, Chen, Kelvin Wei Sheng, Jin Xie, Xiaojing Mu, Chee Wei Tan, Aibin Yu, Hanhua Feng
Published in 2010 Annual International Conference of the IEEE Engineering in Medicine and Biology (01.01.2010)
Published in 2010 Annual International Conference of the IEEE Engineering in Medicine and Biology (01.01.2010)
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Conference Proceeding
Journal Article
A novel die to wafer (D2W) collective bonding method for MEMS and electronics heterogeneous 3D integration
Won Kyoung Choi, Premachandran, C S, Ling Xie, Siong Chiew Ong, He, Johnny Han, Guan Jie Yap, Aibin Yu
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Newly developed integration method for biomedical implants using flexible polymer cable
Yu Daquan, Cheng Ming-Yuan, Lim Li Shiah, Myo Paing, Yu Aibin
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Fabrication of silicon carriers with TSV electrical interconnections and embedded thermal solutions for high power 3-D package
Aibin Yu, Khan, N., Archit, G., Pinjala, D., Kok Chuan Toh, Kripesh, V., Seung Wook Yoon, Lau, J.H.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Development of Fine Pitch Solder Microbumps for 3D Chip Stacking
Aibin Yu, Kumar, A., Soon Wee Ho, Hnin Wai Yin, Lau, J.H., Khong Chee Houe, Lim Pei Siang, S., Xiaowu Zhang, Da-Quan Yu, Nandar Su, Chew Bi-Rong, M., Jong Ming Ching, Tan Teck Chun, Kripesh, V., Lee, C., Jun Pin Huang, Chiang, J., Chen, S., Chi-Hsin Chiu, Chang-Yueh Chan, Chin-Huang Chang, Chih-Ming Huang, Cheng-Hsu Hsiao
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Miniaturized OCT system with optimized housing design
Sheng, K C W, Yu Aibin, Mu Xiaojing, Feng Han Hua, TanChee Wei
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu joint
Liling Yan, Chengkuo Lee, Daquan Yu, Won Kyoung Choi, Aibin Yu, Seung Uk Yoon, Lau, J.H.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Design, process integration and characterization of wafer level vacuum packaging for MEMS resonator
Aibin Yu, Premachandran, C S, Nagarajan, Ranganathan, Choi Won Kyoung, Lam Quynh Trang, Kumar, Rakesh, Li Shiah Lim, Han, Johnny He, Yap Guan Jie, Damaruganath, Pinjala
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding