Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology
Choi, Kwang-Seong, Eom, Yong-Sung, Moon, Seok Hwan, Joo, Jiho, Jeong, leeseul, Lee, Kwangjoo, Kim, Jung Hak, Kim, Ju hyeon, Yoon, Gil-Sang, Lee, Kwang-Hee, Lee, Chul-Hee, Ahn, Geun-Sik, Shim, Moo-Sup
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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