Damage prediction for electronic package drop test using finite element method and peridynamic theory
Agwai, A., Guven, I., Madenci, E.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Failure prediction in fully coupled thermal and deformational fields with peridynamics
Agwai, A., Guven, I., Madenci, E.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
A new thermomechanical fracture analysis approach for 3D integration technology
Agwai, A., Guven, I., Madenci, E.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Peridynamic theory for impact damage prediction and propagation in electronic packages due to drop
Agwai, A., Guven, I., Madenci, E.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Peridynamic theory for failure prediction in multilayer thin-film structures of electronic packages
Agwai, A., Guven, I., Madenci, E.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding