Novel Connector Mechanism Using Anisotropic Conductive Rubber for Trillion-Node Engine as an IoT Edge Platform
Agawa, Kenichi, Mori, Tokihiko, Ninomiya, Ryoji, Takizawa, Minoru, Sakurai, Takayasu
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.01.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.01.2021)
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Conference Proceeding
SEMICONDUCTOR DEVICE
LIU JIA, AGAWA KENICHI, KUROSU ATSUSHI, MIYAHARA HIDETOSHI, IMAIZUMI YUSUKE, TOMIJIMA ATSUSHI
Year of Publication 03.04.2023
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Year of Publication 03.04.2023
Patent
3D-integrated, low-height, small module design techniques for 4.48GHz, 560MHz-bandwidth TransferJet™ transceiver
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Conference Proceeding
MCU and Motor Driver Leaf Modules of Coin-Sized PCBs in an Open-Innovation IoT/CPS Platform
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Published in 2021 International Conference on Electronics Packaging (ICEP) (12.05.2021)
Published in 2021 International Conference on Electronics Packaging (ICEP) (12.05.2021)
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Conference Proceeding
Connection Structure Using Rubber Connectors in the IoT Edge Platform, Trillion Node Engine
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Published in 2018 IEEE CPMT Symposium Japan (ICSJ) (01.11.2018)
Published in 2018 IEEE CPMT Symposium Japan (ICSJ) (01.11.2018)
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Conference Proceeding