by Damodaran, Anoop R., Pandya, Shishir, Agar, Josh C., Cao, Ye, Vasudevan, Rama K., Xu, Ruijuan, Saremi, Sahar, Li, Qian, Kim, Jieun, McCarter, Margaret R., Dedon, Liv R., Angsten, Tom, Balke, Nina, Jesse, Stephen, Asta, Mark, Kalinin, Sergei V., Martin, Lane W.
Published in Advanced materials (Weinheim) (04.10.2017)

by Damodaran, Anoop R., Pandya, Shishir, Qi, Yubo, Hsu, Shang-Lin, Liu, Shi, Nelson, Christopher, Dasgupta, Arvind, Ercius, Peter, Ophus, Colin, Dedon, Liv R., Agar, Josh C., Lu, Hongling, Zhang, Jialan, Minor, Andrew M., Rappe, Andrew M., Martin, Lane W.
Published in Nature communications (10.05.2017)

by Zhang, Rongwei, Moon, Kyoung-sik, Lin, Wei, Agar, Josh C., Wong, Ching-Ping
Published in Composites science and technology (28.02.2011)

by Damodaran, Anoop R, Pandya, Shishir, Agar, Josh C, Cao, Ye, Vasudevan, Rama K, Xu, Ruijuan, Saremi, Sahar, Li, Qian, Kim, Jieun, McCarter, Margaret R, Dedon, Liv R, Angsten, Tom, Balke, Nina, Jesse, Stephen, Asta, Mark, Kalinin, Sergei V, Martin, Lane W
Published in Advanced materials (Weinheim) (01.10.2017)

by Damodaran, Anoop R., Pandya, Shishir, Agar, Josh C., Cao, Ye, Vasudevan, Rama K., Xu, Ruijuan, Saremi, Sahar, Li, Qian, Kim, Jieun, McCarter, Margaret R., Dedon, Liv R., Angsten, Tom, Balke, Nina, Jesse, Stephen, Asta, Mark, Kalinin, Sergei V., Martin, Lane W.
Published in Advanced materials (Weinheim) (31.07.2017)

by Rongwei Zhang, Agar, J C, Wong, C P
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)