Thermal shock reliability of micro–nano bimodal Cu–Ag sintered joints
Son, Kirak, Oh, Aesun, Park, Eunyoung, Bae, Hyun-Cheol
Published in Journal of materials science. Materials in electronics (01.08.2022)
Published in Journal of materials science. Materials in electronics (01.08.2022)
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Journal Article
Cost-effective thermoelectric cooler packaging using hybrid Cu paste
Hyun-Cheol Bae, Yong-Sung Eom, Aesun Oh, Haksun Lee, Kwang-Seong Choi, Seung Eon Moon, Jin Ho Lee
Published in 2015 European Microelectronics Packaging Conference (EMPC) (01.09.2015)
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Published in 2015 European Microelectronics Packaging Conference (EMPC) (01.09.2015)
Conference Proceeding