by Liu, Shi-Fang, Abothu, Isaac Robin, Komarneni, Sridhar
Published in Materials letters (01.03.1999)

by Kalpat, Sriram, Du, X., Abothu, Issac R., Akiba, Akira, Goto, Hiroshi, Uchino, Kenji
Published in Japanese Journal of Applied Physics (2001)

by Balaraman, D, Raj, P M, Wan, L, Abothu, I R, Bhattacharya, S, Dalmia, S, Lance, M J, Swaminathan, M, Sacks, M D, Tummala, R R
Published in Journal of electroceramics (01.07.2004)

by ABOTHU, I. R, JIN, W, WANG, R, CHUNG, T.-S
Published in Journal of materials science (15.01.2004)

by Abothu, Isaac Robin, Prasada Rao, A.V., Komarneni, S.
Published in Materials letters (1999)

by SARUHAN, B, SCHNEIDER, H, KOMARNENI, S, ABOTHU, I. R
Published in Journal of the European Ceramic Society (01.01.1999)

by Aggarwal, A.O., Abothu, I.R., Raj, P.M., Sacks, M.D., Tummala, R.R.
Published in IEEE transactions on components and packaging technologies (01.09.2007)

by Balaraman, D., Raj, P.M., Abothu, R., Bhattacharya, S., Sacks, M., Lance, M., Meyer, H., Swaminathan, M., Tumrnala, R.
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)

by Raj, P.M., Balaraman, D., Govind, V., Abothu, I.R., Lixi Wan, Gerhardt, R., Swaminathan, M., Tummala, R.
Published in IEEE transactions on components and packaging technologies (01.12.2007)

by Markondeya Raj, P., Balaraman, D., Govind, V., Wan, L., Abothu, R., Gerhardt, R., Bhattacharya, S., Swaminathan, M., Tummala, R.
Published in Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) (2004)

by Raj, P.M., Balaraman, D., Abothu, I.R., Chong Yoon, Nam-Kee Kang, Rao Tummala
Published in IEEE transactions on components and packaging technologies (01.12.2007)

by Saruhan, Bilge, Abothu, Isaac Robin, Komarneni, Sridhar, Loong, Chun-Keung
Published in Journal of the American Ceramic Society (01.12.2000)

by ABOTHU, I. R, KOMARNENI, S, PAIK, D.-S, JENTSCH, H. G
Published in Journal of electroceramics (01.04.1999)

by DONG SOO PAIK, KOMARNENI, S, ABOTHU, I. R, PRASADA RAO, A. V
Published in Journal of materials chemistry (1997)

by Raj, P. Markondeya, Xiang, Shu, Kumar, Manish, Abothu, Isaac Robin, Hwang, Jin-Hyun, Liu, Yuzi, Yamamoto, Hiroshi, Tummala, Rao
Published in Journal of materials science. Materials in electronics (01.04.2012)

by Aggarwal, A.O., Raj, P.M., Abothu, I.R., Sacks, M.D., Tayl, A.A.O., Tummala, R.R.
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)

by Abothu, I R, Jin, W, Wang, R, Chung, T
Published in Journal of materials science (15.01.2004)

by Abothu, I. R., Jin, W., Wang, R., Chung, T.-S.
Published in Journal of materials science (01.01.2004)

by Aggarwal, A.O., Raj, P.M., Abothu, I.R., Ravi, D., Sacks, M.D., Tay, A.A.O., Tummala, R.R.
Published in 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings (2004)

by Aggarwal, A.O., Abothu, I.R., Raj, P.M., Ravi, D., Sacks, M.D., Tay, A.O., Tummala, R.R.
Published in Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) (2003)