An all-solid-state, WDM silicon photonic digital link for chip-to-chip communications
Thacker, Hiren D, Zheng, Xuezhe, Lexau, Jon, Shafiiha, Roshanak, Shubin, Ivan, Lin, Shiyun, Djordjevic, Stevan, Amberg, Philip, Chang, Eric, Liu, Frankie, Simons, John, Lee, Jin-Hyoung, Abed, Arin, Liang, Hong, Luo, Ying, Yao, Jin, Feng, Dazeng, Asghari, Mehdi, Ho, Ron, Raj, Kannan, Cunningham, John E, Krishnamoorthy, Ashok V
Published in Optics express (18.05.2015)
Published in Optics express (18.05.2015)
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Journal Article
4×100Gb/s PAM4 Multi-Channel Silicon Photonic Chipset With Hybrid Integration of III-V DFB Lasers and Electro-Absorption Modulators
Levy, Jacob S., Timurdogan, Erman, Kuo, Yu-Sheng, Lyu, Gap Youl, Tsai, Charles, Yan, Xuejin, Kim, Harqkyun, Stagarescu, Cristian, Meneou, Kevin, Thomas, Abu, Fragkos, Ioannis, Sitwell, Geoffrey, Trita, Andrea, Liu, Yangyang, Ziebel, Melissa, Byrd, Jerry, Steinbach, Sven, Chou, Bruce, Vis, William, Abed, Arin, Kwon, Young, Nykänen, Henri, Lo, Shih-Han, Ikonen, Janne, Larismaa, Juha, Drake, John, Benzoni, Albert, Minkenberg, Cyriel, Schrans, Thomas, Rickman, Andrew
Published in Journal of lightwave technology (15.08.2023)
Published in Journal of lightwave technology (15.08.2023)
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Journal Article
4x100Gb/s PAM4 Multi-Channel Silicon Photonic Chipset with Hybrid Integration of III-V DFB Lasers and Electro-Absorption Modulators
Levy, Jacob S., Timurdogan, Erman, Kuo, Yu-Sheng, Lyu, Gap Youl, Tsai, Charles, Yan, Xuejin, Kim, Harqkyun, Stagarescu, Cristian, Meneou, Kevin, Thomas, Abu, Fragkos, Ioannis, Sitwell, Geoffrey, Trita, Andrea, Liu, Yangyang, Ziebel, Melissa, Byrd, Jerry, Steinbach, Sven, Chou, Bruce, Vis, William, Abed, Arin, Kwon, Young, Nykanen, Henri, Lo, Shih-Han, Ikonen, Janne, Larismaa, Juha, Drake, John, Benzoni, Albert, Minkenberg, Cyriel, Schrans, Thomas, Rickman, Andrew
Published in Journal of lightwave technology (15.08.2023)
Published in Journal of lightwave technology (15.08.2023)
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Journal Article
OPTOELECTRONIC MODULE PACKAGE
BYRD, Gerald Cois, ABED, Arin, BCHIR, Omar James, SCHRANS, Thomas Pierre, CHOU, Chia-Te
Year of Publication 07.04.2022
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Year of Publication 07.04.2022
Patent
Optoelectronic module package
Abed, Arin, Schrans, Thomas Pierre, Byrd, Gerald Cois, Chou, Chia-Te, Bchir, Omar James
Year of Publication 01.02.2022
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Year of Publication 01.02.2022
Patent
Optoelectronic module package
Thomas Pierre Schrans, Gerald Cois Byrd, Arin Abed, Chia-Te Chou, Omar James Bchir
Year of Publication 01.12.2021
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Year of Publication 01.12.2021
Patent
OPTOELECTRONIC MODULE PACKAGE
ZILKIE, Aaron John, BYRD, Gerald Cois, TIMURDOGAN, Erman, ABED, Arin, BCHIR, Omar James, SCHRANS, Thomas Pierre, CHOU, Chia-Te
Year of Publication 18.08.2022
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Year of Publication 18.08.2022
Patent
Optoelectronic module package
Gerald Cois Byrd, Thomas Schrans, Arin Abed, Chia-Te Chou, Omar James Bchir
Year of Publication 03.04.2019
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Year of Publication 03.04.2019
Patent
OPTOELECTRONIC MODULE PACKAGE
Abed, Arin, Schrans, Thomas Pierre, Byrd, Gerald Cois, Chou, Chia-Te, Bchir, Omar James
Year of Publication 07.02.2019
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Year of Publication 07.02.2019
Patent
Hybrid integration and packaging of an energy-efficient WDM silicon photonic chip-to-chip interconnect
Thacker, Hiren D., Shafiiha, Roshanak, Lexau, Jon, Xuezhe Zheng, Djordjevic, Stevan S., Shiyun Lin, Simons, John, Abed, Arin, Amberg, Phil, Chang, Eric, Shubin, Ivan, Jin-Hyoung Lee, Ying Luo, Jin Yao, Liu, Frankie, Hong Liang, Feng, Dazeng, Asghari, Mehdi, Ron Ho, Raj, Kannan, Krishnamoorthy, Ashok V., Cunningham, John E.
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding