Compact Silicon Electro-Optical Modulator Using Hybrid ITO Tri-Coupled Waveguides
Abdelatty, Mohamed Y., Badr, Mohamed M., Swillam, Mohamed A.
Published in Journal of lightwave technology (15.09.2018)
Published in Journal of lightwave technology (15.09.2018)
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Journal Article
Modeling the effect of trace profiles on the RF performance of additively manufactured microstrip transmission lines on polyimide substrates
Umar, Ashraf, Abdelatty, Mohamed. Y., Khinda, Gurvinder S., Alhendi, Mohammed, Poliks, Mark. D.
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Performance Evaluation of RF Novel Microstrip Lines Printed on Flexible Substrates
Obeidat, Abdullah S., Alhendi, Mohammed, Abdelatty, Mohamed Y., Umar, Ashraf, Enakerakpo, Emuobosan, Al-Haidari, Riadh, Poliks, Mark D.
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)
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Conference Proceeding
The role of surface roughness on the electrical behavior of flexible and stretchable screen-printed silver ink on Kapton substrate
Abdelatty, Mohamed Y, Umar, Ashraf, Khinda, Gurvinder S, Cadwell, Ryan J, Levy, Joshua A, Huang, Nancy, Weerawarne, Darshana L, Alhendi, Mohammed, Miller, Scott M, Poliks, Mark D
Published in Flexible and printed electronics (01.12.2023)
Published in Flexible and printed electronics (01.12.2023)
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Journal Article
Embedded RF Packaging Via Ceramic 3D Printing and Printed Electronics Additive Manufacturing
Obeidat, Abdullah S., Umar, Ashraf, Dou, Zhi, Alshatnawi, Firas, Al-Haidari, Riadh, Al-Shaibani, Waleed, Alhendi, Mohammed, Abdelatty, Mohamed Y., Boyd, Linda, Hoel, Cathleen, Valle Angulo, Genaro Soto, Budka, Thomas, Case, Jason, Iannotti, Joseph, Pavinatto, Felippe, Poliks, Mark D.
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Empirical Model and Experimental Validation of Meshed Ground Impact on RF Performance of Flexible Microstrip Lines for Bending Applications
Abdelatty, Mohamed Y., Alhendi, Mohammed, Obeidat, Abdullah S., Umar, Ashraf, Enakerakpo, Emuobosan, Al-Haidari, Riadh, Poliks, Mark D.
Published in IEEE journal on flexible electronics (27.05.2024)
Published in IEEE journal on flexible electronics (27.05.2024)
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Journal Article
Modeling the effect of surface roughness for screen-printed silver ink on flexible substrates
Abdelatty, Mohamed Y., Umar, Ashraf, Khinda, Gurvinder S., Alhendi, Mohammed, Poliks, Mark D.
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding