Compliant Interconnects Based on Single Micrometer-sized Metal-Coated Polymer Spheres
Huynh, Van Long, Aasmundtveit, Knut E., Nguyen, Hoang-Vu
Published in ACS applied materials & interfaces (06.11.2024)
Published in ACS applied materials & interfaces (06.11.2024)
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Journal Article
Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization
Luu, Thi-Thuy, Duan, Ani, Aasmundtveit, Knut E., Hoivik, Nils
Published in Journal of electronic materials (01.12.2013)
Published in Journal of electronic materials (01.12.2013)
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Journal Article
Thermal Conductivity and Mechanical Properties of Polymer Composites with Hexagonal Boron Nitride-A Comparison of Three Processing Methods: Injection Moulding, Powder Bed Fusion and Casting
Do, Nu Bich Duyen, Imenes, Kristin, Aasmundtveit, Knut E, Nguyen, Hoang-Vu, Andreassen, Erik
Published in Polymers (01.03.2023)
Published in Polymers (01.03.2023)
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Journal Article
Rheological characterization of a novel isotropic conductive adhesive – Epoxy filled with metal-coated polymer spheres
Nguyen, Hoang-Vu, Andreassen, Erik, Kristiansen, Helge, Johannessen, Rolf, Hoivik, Nils, Aasmundtveit, Knut E.
Published in Materials in engineering (01.04.2013)
Published in Materials in engineering (01.04.2013)
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Journal Article
Thermal management of an interventional medical device with double layer encapsulation
Do, Nu Bich Duyen, Andreassen, Erik, Edwardsen, Stephen, Lifjeld, Anders, Aasmundtveit, Knut E., Nguyen, Hoang-Vu, Imenes, Kristin
Published in Experimental heat transfer (29.07.2022)
Published in Experimental heat transfer (29.07.2022)
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Journal Article
Integration of Carbon Nanotubes in Microsystems: Local Growth and Electrical Properties of Contacts
Haugen, Tormod B, Ta, Bao Q, Halvorsen, Einar, Hoivik, Nils, Aasmundtveit, Knut E
Published in Materials (24.07.2013)
Published in Materials (24.07.2013)
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Journal Article
In–Bi low-temperature SLID bonding for piezoelectric materials
Aasmundtveit, Knut E, Eggen, Trym, Manh, Tung, Nguyen, Hoang-Vu
Published in Soldering & surface mount technology (27.03.2018)
Published in Soldering & surface mount technology (27.03.2018)
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Journal Article
Direct integration of carbon nanotubes in Si microstructures
Aasmundtveit, Knut E, Ta, Bao Q, Lin, Liwei, Halvorsen, Einar, Hoivik, Nils
Published in Journal of micromechanics and microengineering (01.07.2012)
Published in Journal of micromechanics and microengineering (01.07.2012)
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Journal Article
Conference Proceeding
Influence of Glass-Frit Material Distribution on the Performance of Precision Piezoresistive MEMS Pressure Sensors
Sandvand, Asmund, Halvorsen, Einar, Aasmundtveit, Knut E., Jakobsen, Henrik
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2015)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2015)
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Journal Article
Characterization of Wafer-Level Au-In-Bonded Samples at Elevated Temperatures
Luu, Thi-Thuy, Hoivik, Nils, Wang, Kaiying, Aasmundtveit, Knut E., Vardøy, Astrid-Sofie B.
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (01.06.2015)
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (01.06.2015)
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Journal Article
High-Temperature Mechanical Integrity of Cu-Sn SLID Wafer-Level Bonds
Luu, Thi-Thuy, Hoivik, Nils, Wang, Kaiying, Aasmundtveit, Knut E., Vardøy, Astrid-Sofie B.
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (01.11.2015)
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (01.11.2015)
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Journal Article
Die Shear Testing of a Novel Isotropic Conductive Adhesive-Epoxy Filled With Metal-Coated Polymer Spheres
Nguyen, Hoang-Vu, Andreassen, Erik, Kristiansen, Helge, Aasmundtveit, Knut E.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2013)
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Journal Article