Search Results - "ASPANDIAR, Raiyomand" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Silicon photonic integrated lens compatible with wafer processing

Silicon photonic integrated lens compatible with wafer processing

by Aspandiar, Raiyomand, Agrawal, Ankur, Heck, John, Tran, Quan, Jadhav, Susheel, Narayan, Raghuram, Dobriyal, Priyanka, Brown, Kenneth
Year of Publication 06.02.2024

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Patent

Decoupling layer to reduce underfill stress in semiconductor devices

Decoupling layer to reduce underfill stress in semiconductor devices

by Brown, Kenneth M, Aspandiar, Raiyomand F, Agrawal, Ankur, Jadhav, Susheel G, Tran, Quan A, Dobriyal, Priyanka
Year of Publication 01.08.2023

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Patent

MULTIPLE METAL LAYERS WITHIN A PHOTONICS INTEGRATED CIRCUIT FOR THERMAL TRANSFER

MULTIPLE METAL LAYERS WITHIN A PHOTONICS INTEGRATED CIRCUIT FOR THERMAL TRANSFER

by SHAH, Hemant Mahesh, AGRAWAL, Ankur, ASPANDIAR, Raiyomand, DOBRIYAL, Priyanka, MALLIK, Aditi, CARANTO, Neil Raymund, FATHOLOLOUMI, Saeed, PRAKASH, Anna
Year of Publication 29.12.2022

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Patent

SELECTIVE PROTECTION OF INTEGRATED CIRCUIT CHIP SURFACE REGIONS FROM UNDERFILL CONTACT

SELECTIVE PROTECTION OF INTEGRATED CIRCUIT CHIP SURFACE REGIONS FROM UNDERFILL CONTACT

by Yao, Jimin, Aspandiar, Raiyomand F, Prakash, Anna M, Agrawal, Ankur, Wood, Lesley A. Polka, Helms, Kayleen L. E, Agwai, Abigail G, Dobriyal, Priyanka, Xu, Ann J
Year of Publication 16.03.2023

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Patent

Apparatus and method for conformal coating of integrated circuit packages

Apparatus and method for conformal coating of integrated circuit packages

by Aspandiar, Raiyomand F, Ramalingam, Suriyakala, Dobriyal, Priyanka, Lee, Chester C
Year of Publication 16.07.2019

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Patent

SILICON PHOTONIC INTEGRATED LENS COMPATIBLE WITH WAFER PROCESSING

SILICON PHOTONIC INTEGRATED LENS COMPATIBLE WITH WAFER PROCESSING

by HECK, John, AGRAWAL, Ankur, ASPANDIAR, Raiyomand, NARAYAN, Raghuram, DOBRIYAL, Priyanka, JADHAV, Susheel, BROWN, Kenneth, TRAN, Quan
Year of Publication 11.03.2021

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Patent

DECOUPLING LAYER TO REDUCE UNDERFILL STRESS IN SEMICONDUCTOR DEVICES

DECOUPLING LAYER TO REDUCE UNDERFILL STRESS IN SEMICONDUCTOR DEVICES

by Brown, Kenneth M, Aspandiar, Raiyomand F, Agrawal, Ankur, Jadhav, Susheel G, Tran, Quan A, Dobriyal, Priyanka
Year of Publication 04.03.2021

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Patent

CONFORMAL COATING OF INTEGRATED CIRCUIT PACKAGES

CONFORMAL COATING OF INTEGRATED CIRCUIT PACKAGES

by LEE, Chester C, DOBRIYAL, Priyanka, RAMALINGAM, Suriyakala, ASPANDIAR, Raiyomand F
Year of Publication 15.03.2018

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Patent

CONFORMAL COATING OF INTEGRATED CIRCUIT PACKAGES

CONFORMAL COATING OF INTEGRATED CIRCUIT PACKAGES

by Dobriyal Priyanka, Lee Chester C, Aspandiar Raiyomand F, Ramalingam Suriyakala
Year of Publication 08.03.2018

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Patent

Surface mount component

Surface mount component

by Fartash, Arjang, Aspandiar, Raiyomand
Year of Publication 17.10.2002

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Patent

Surface mount component

Surface mount component

by FARTASH ARJANG, ASPANDIAR RAIYOMAND F
Year of Publication 22.04.2003

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Patent

Surface mount component

Surface mount component

by Fartash, Arjang, Aspandiar, Raiyomand F
Year of Publication 22.04.2003

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Patent

Surface mount component

Surface mount component

by FARTASH ARJANG, ASPANDIAR RAIYOMAND F
Year of Publication 17.10.2002

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Patent

Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering

Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering

by Aspandiar, Raiyomand, Pearson, Tom, Combs, Christopher
Year of Publication 27.03.2003

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Patent

Heat-shrinkable retainer for PCB double-sided assembly

Heat-shrinkable retainer for PCB double-sided assembly

by ASPANDIAR RAIYOMAND, COMBS CHRISTOPHER D, FARTASH ARJANG, PEARSON TOM E
Year of Publication 07.11.2006

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Patent

Heat-shrinkable retainer for PCB double-sided assembly

Heat-shrinkable retainer for PCB double-sided assembly

by Fartash, Arjang, Combs, Christopher D, Aspandiar, Raiyomand, Pearson, Tom E
Year of Publication 07.11.2006

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Patent

METHODS FOR RETAINING ASSEMBLED COMPONENTS

METHODS FOR RETAINING ASSEMBLED COMPONENTS

by COMBS, CHRISTOPHER D, FARTASH, ARJANG, PEARSON, TOM E, ASPANDIAR, RAIYOMAND
Year of Publication 31.05.2006

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Patent

Heat-shrinkable retainer for PCB double-sided assembly

Heat-shrinkable retainer for PCB double-sided assembly

by Fartash, Arjang, Combs, Christopher D, Aspandiar, Raiyomand, Pearson, Tom E
Year of Publication 14.06.2005

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Patent

Heat-shrinkable retainer for PCB double-sided assembly

Heat-shrinkable retainer for PCB double-sided assembly

by ASPANDIAR RAIYOMAND, COMBS CHRISTOPHER D, FARTASH ARJANG, PEARSON TOM E
Year of Publication 14.06.2005

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Patent

Epoxy washer for retention of inverted SMT components

Epoxy washer for retention of inverted SMT components

by ASPANDIAR RAIYOMAND, FARTASH ARJANG, PEARSON TOM, COMBS CHRISTOPHER
Year of Publication 06.04.2005

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Patent