CPI Parametric Investigation of UBM-Al Interface for Cu Pillar Flip-Chip Application
Lianto, Prayudi, Hong Yu Li, Balamurugan, R., Junqi Wei, Binte Jaafar, Norhanani, Wai, Leong Ching Eva, Sundarrajan, Arvind
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2016)
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Journal Article
Under-Bump Metallization Contact Resistance ( R ) Characterization at 10- \mu \text Polymer Passivation Opening
Lianto, Prayudi, King-Jien Chui, Bhushan, Bharat, Chua, H. M. Calvin, Leijun Tang, Chandra Rao, B. S. S., Xin Wang, Ai Long Wu, Yu Gu, Guan Huei See, Sundarrajan, Arvind
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2017)
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Journal Article
Unravelling metallic contaminants in complex polyimide heterostructures using deep ultraviolet spectroscopic ellipsometry
Naradipa, Muhammad Avicenna, Lianto, Prayudi, See, Gilbert, Sundarrajan, Arvind, Rusydi, Andrivo
Year of Publication 06.08.2023
Year of Publication 06.08.2023
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Journal Article
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESPUTTERING
GOPALRAJA PRABURAM, TANG XIANMIN, CHEN FUSEN, TAO RONG, LUBBEN DANIEL C, MILLER MICHAEL A, RENGARAJAN SURAJ, XU ZHENG, MOSELY RODERICK C, JIANMING FU, ARVIND SUNDARRAJAN, FORSTER JOHN C, DING PEIJUN
Year of Publication 12.11.2015
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Year of Publication 12.11.2015
Patent
Enabling Die-to-Wafer Hybrid Bonding for the Next Generation Advanced 3D Packaging
Hung, Raymond, See, Gilbert, Wang, Ying, Yong, Chang Bum, Zheng, Ke, Chang, Yauloong, Shantaram, Avi, Wang, Ruiping, Sundarrajan, Arvind, Abdilla, Jonathan, Hegde, Nithyananda, Schmid, Stefan, Bikaljevic, Djuro, Glantschnig, Manfred
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
A Holistic Development Framework for Hybrid Bonding
Sitaraman, Srikrishna, Jiang, Liu, Dag, Sefa, Masoomi, Mohammad, Wang, Ying, Lianto, Prayudi, An, Jinho, Wang, Ruiping, See, Gilbert, Sundarrajan, Arvind, Bazizi, El Mehdi, Ayyagari-Sangamalli, Buvna
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
SEE, Guan, RUSYDI, Andrivo, NARADIPA, Muhammad, LIANTO, Prayudi, SUNDARRAJAN, Arvind
Year of Publication 03.08.2023
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Year of Publication 03.08.2023
Patent
Methods for forming microwave tunable composited thin-film dielectric layer
Cui, Yue, See, Guan Huei, Sundarrajan, Arvind, Chen, Nuno Yen-Chu, Ow, Yueh Sheng, Deng, Felix
Year of Publication 30.07.2024
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Year of Publication 30.07.2024
Patent
SILICON (SI) DRY ETCH FOR DIE-TO-WAFER THINNING
YONG, ChangBum, SEE, Guan Huei, LIANTO, Prayudi, SUNDARRAJAN, Arvind, SUN, Cheng
Year of Publication 27.06.2024
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Year of Publication 27.06.2024
Patent
Silicon (Si) Dry Etch for Die-to-Wafer Thinning
YONG, ChangBum, SEE, Guan Huei, LIANTO, Prayudi, SUNDARRAJAN, Arvind, SUN, Cheng
Year of Publication 27.06.2024
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Year of Publication 27.06.2024
Patent
Methods and apparatus for processing a substrate
See, Guan Huei, Sundarrajan, Arvind, Naradipa, Muhammad Avicenna, Rusydi, Andrivo, Lianto, Prayudi
Year of Publication 25.06.2024
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Year of Publication 25.06.2024
Patent
METHODS OF TSV FORMATION FOR ADVANCED PACKAGING
SEE, Guan Huei, WANG, Ying W, SUO, Peng, SUNDARRAJAN, Arvind, YONG, Chang Bum
Year of Publication 14.03.2024
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Year of Publication 14.03.2024
Patent