Ultrathin strained si-on-insulator and sige-on-insulator created using low temperature wafer bonding and metastable stop layers
TARASCHI, Gianni, PITERA, Arthur J, MCGILL, Lisa M, CHENG, Zhi-Yuan, LEE, Minjoo L, LANGDO, Thomas A, FITZGERALD, Eugene A
Published in Journal of the Electrochemical Society (2004)
Published in Journal of the Electrochemical Society (2004)
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Journal Article
Strained Si, SiGe, and Ge on-insulator: review of wafer bonding fabrication techniques
Taraschi, Gianni, Pitera, Arthur J., Fitzgerald, Eugene A.
Published in Solid-state electronics (01.08.2004)
Published in Solid-state electronics (01.08.2004)
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Journal Article
Strained-Silicon on Silicon and Strained-Silicon on Silicon-Germanium on Silicon by Relaxed Buffer Bonding
Isaacson, David M., Taraschi, Gianni, Pitera, Arthur J., Ariel, Nava, Langdo, Thomas A., Fitzgerald, Eugene A.
Published in Journal of the Electrochemical Society (2006)
Published in Journal of the Electrochemical Society (2006)
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Journal Article
Positive temperature coefficient of impact ionization in strained-Si
Waldron, N.S., Pitera, A.J., Lee, M.L., Fitzgerald, E.A., del Alamo, J.A.
Published in IEEE transactions on electron devices (01.07.2005)
Published in IEEE transactions on electron devices (01.07.2005)
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Journal Article
Hole mobility enhancement in strained-Si/strained-SiGe heterostructure p-MOSFETs fabricated on SiGe-on-insulator (SGOI)
Cheng, Zhiyuan, Jung, Jongwan, Lee, Minjoo L, Pitera, Arthur J, Hoyt, Judy L, Antoniadis, Dimitri A, Fitzgerald, Eugene A
Published in Semiconductor science and technology (01.05.2004)
Published in Semiconductor science and technology (01.05.2004)
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Journal Article
Monolithically integrated thin film III-V/Si solar panel on wafer for active power management
Pitera, A. J., Hennessy, J., Malonis, A. C., Fitzgerald, E. A., Ringel, S. A.
Published in 2011 37th IEEE Photovoltaic Specialists Conference (01.06.2011)
Published in 2011 37th IEEE Photovoltaic Specialists Conference (01.06.2011)
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Conference Proceeding
Coplanar Integration of Lattice-Mismatched Semiconductors with Silicon by Wafer Bonding Ge/Si[sub 1−x]Ge[sub x]/Si Virtual Substrates
Pitera, Arthur J., Taraschi, G., Lee, M. L., Leitz, C. W., Cheng, Z.-Y., Fitzgerald, E. A.
Published in Journal of the Electrochemical Society (2004)
Published in Journal of the Electrochemical Society (2004)
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Journal Article
Interposer with first and second adhesive layers
Bowen, M. Shane, Yuan, Dajun, Zimmerley, Maxwell, Modiano, Steven H, Kreindl, Gerald, Tran, Hai Quang, Qiang, LiangLiang, Smith, Randall, Pitera, Arthur J
Year of Publication 10.09.2024
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Year of Publication 10.09.2024
Patent
INTERPOSER WITH FIRST AND SECOND ADHESIVE LAYERS
LIANGLIANG QIANG, GERALD KREINDL, RANDALL SMITH, DAJUN YUAN, M. SHANE BOWEN, HAI QUANG TRAN, STEVEN H MODIANO, MAXWELL ZIMMERLEY, ARTHUR J PITERA
Year of Publication 24.04.2024
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Year of Publication 24.04.2024
Patent
Interposer with first and second adhesive layers
SMITH, Randall, TRAN, Hai Quang, PITERA, Arthur J, KREINDL, Gerald, YUAN, Dajun, ZIMMERLEY, Maxwell, QIANG, LiangLiang, MODIANO, Steven H, BOWEN, M. Shane
Year of Publication 13.04.2023
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Year of Publication 13.04.2023
Patent
INTERPOSER WITH FIRST AND SECOND ADHESIVE LAYERS
Bowen, M. Shane, Yuan, Dajun, Zimmerley, Maxwell, Modiano, Steven H, Kreindl, Gerald, Tran, Hai Quang, Qiang, LiangLiang, Smith, Randall, Pitera, Arthur J
Year of Publication 11.08.2022
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Year of Publication 11.08.2022
Patent
INTERPOSER WITH FIRST AND SECOND ADHESIVE LAYERS
Bowen, M. Shane, Yuan, Dajun, Zimmerley, Maxwell, Modiano, Steven H, Kreindl, Gerald, Tran, Hai Quang, Quang, LiangLiang, Smith, Randall, Pitera, Arthur J
Year of Publication 25.05.2022
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Year of Publication 25.05.2022
Patent
INTERPOSER WITH FIRST AND SECOND ADHESIVE LAYERS
Bowen, M. Shane, Yuan, Dajun, Zimmerley, Maxwell, Modiano, Steven H, Kreindl, Gerald, Tran, Hai Quang, Quang, LiangLiang, Smith, Randall, Pitera, Arthur J
Year of Publication 09.02.2022
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Year of Publication 09.02.2022
Patent
1EV GANxAS1-x-ySBy material for lattice-matched III-V solar cell implementation on GaAs and Ge
Ng, T.K., Yoon, S.F., Kian Hua Tan, Loke, W.K., Wicaksono, S., Lew, K.L., Kah Pin Chen, Fitzgerald, E.A., Pitera, A.J., Ringel, S.A., Carlin, A.M., Gonzalez, M.
Published in 2009 34th IEEE Photovoltaic Specialists Conference (PVSC) (01.06.2009)
Published in 2009 34th IEEE Photovoltaic Specialists Conference (PVSC) (01.06.2009)
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Conference Proceeding
INTERPOSER WITH FIRST AND SECOND ADHESIVE LAYERS
SMITH, Randall, TRAN, Hai Quang, QIANG, Liangliang, BOWEN, Shane M, PITERA, Arthur J, KREINDL, Gerald, YUAN, Dajun, ZIMMERLEY, Maxwell, MODIANO, Steven H
Year of Publication 28.06.2021
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Year of Publication 28.06.2021
Patent
INTERPOSER WITH FIRST AND SECOND ADHESIVE LAYERS
YUAN Dajun, MODIANO Steven H, TRAN Hai Quang, ZIMMERLEY Maxwell, QIANG Liangliang, PITERA Arthur J, SMITH Randall, BOWEN M. Shane, KREINDL Gerald
Year of Publication 27.05.2021
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Year of Publication 27.05.2021
Patent
Interposer with first and second adhesive layers
QIANG LiangLiang, YUAN Dajun, MODIANO Steven H, ZIMMERLEY Maxwell, PITERA Arthur J, TRAN Hai Quang, SMITH Randall, BOWEN M. Shane, KREINDL Gerald
Year of Publication 31.01.2021
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Year of Publication 31.01.2021
Patent