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Published in Medicina (Kaunas, Lithuania) (01.09.2022)
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Published in Jpn J Appl Phys (01.04.2012)
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Tungsten Film Chemical Mechanical Polishing Using MnO2 Slurry
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Published in Jpn J Appl Phys (01.07.2011)
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A New Circuit Simulation Model of Ferroelectric Capacitors
Tamura, Tetsuro, Arimoto, Yoshihiro, Ishiwara, Hiroshi
Published in Japanese Journal of Applied Physics (01.04.2002)
Published in Japanese Journal of Applied Physics (01.04.2002)
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Reconditioning-free polishing for interlayer-dielectric planarization
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Conference Proceeding
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Published in Jpn J Appl Phys (01.04.2012)
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Pulse-Field-Assisted Wafer Bonding for Silicon on Insulator
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Published in Japanese Journal of Applied Physics (01.06.1992)
Published in Japanese Journal of Applied Physics (01.06.1992)
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Boron diffusion through pure silicon oxide and oxynitride used for metal-oxide-semiconductor devices
AOYAMA, T, SUZUKI, K, TASHIRO, H, TODA, Y, YAMAZAKI, T, ARIMOTO, Y, ITO, T
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Published in Journal of the Electrochemical Society (01.12.1993)
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Published in Japanese Journal of Applied Physics (01.04.1998)
Published in Japanese Journal of Applied Physics (01.04.1998)
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A new SOI-lateral bipolar transistor for high-speed operation
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Published in Japanese Journal of Applied Physics (01.12.1991)
Published in Japanese Journal of Applied Physics (01.12.1991)
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Direct deposition of SrBi2Ta2O9 Film on IrO2 electrode using liquid source CVD method
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Published in Integrated ferroelectrics (01.10.1999)
Published in Integrated ferroelectrics (01.10.1999)
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Si wafer bonding with Ta silicide formation
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Published in Japanese Journal of Applied Physics (01.10.1991)
Published in Japanese Journal of Applied Physics (01.10.1991)
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ARIMOTO YOSHIHIRO, KATAYAMA KOJI, KIDA HITOSHI, OTOSHI HIROKI, SUGIOKA YUKIO
Year of Publication 26.05.2016
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Patent
Application of Reversed Silicon Wafer Direct Bonding to Thin-Film SOI Power ICs
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Published in Japanese Journal of Applied Physics (01.03.1998)
Published in Japanese Journal of Applied Physics (01.03.1998)
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