Fine pitch copper wire bonding in high volume production
Appelt, Bernd K., Tseng, Andy, Chen, Chun-Hsiung, Lai, Yi-Shao
Published in Microelectronics and reliability (2011)
Published in Microelectronics and reliability (2011)
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Journal Article
The thin package challenge
Appelt, Bernd K
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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Conference Proceeding
Three years of fine Cu wire bonding in high volume manufacturing
Appelt, B. K., Huang, L., Lai, Y., Chen, S.
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
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Conference Proceeding
Copper Wire Bonding in High Volume Manufacturing
Appelt, Bernd K., Tseng, Andy, Lai, Yi-Shao, Chen, Chun-Hsiung
Published in ECS transactions (01.01.2011)
Published in ECS transactions (01.01.2011)
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Journal Article
Thin packages enabling thin mobile products
Chen, W. T., Tseng, A., Appelt, B. K.
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)
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Conference Proceeding
Fine pitch copper wire bonding - Why now?
Appelt, B.K., Tseng, A., Yi-Shao Lai
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Cu wire bonding knows no limit - 28 nm is qualified
Appelt, B. K., Tseng, A., Uegaki, S., Huang, L.
Published in 2012 2nd IEEE CPMT Symposium Japan (01.12.2012)
Published in 2012 2nd IEEE CPMT Symposium Japan (01.12.2012)
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Conference Proceeding
Is copper wire bonding ready for automotive applications?
Appelt, B. K., Tseng, A., Huang, L., Chen, S.
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Thin packaging - What is next?
Appelt, B. K., Tseng, A., Uegaki, S., Essig, K.
Published in 2012 2nd IEEE CPMT Symposium Japan (01.12.2012)
Published in 2012 2nd IEEE CPMT Symposium Japan (01.12.2012)
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Conference Proceeding
Fine pitch copper wire bonding introduction to high volume production
Appelt, B K, Tseng, A, Yi-Shao Lai
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
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Conference Proceeding
Copper wire bonding - A maturing technology
Appelt, B K, Tseng, A, Yi-Shao Lai, Chun-Hsiung Chen
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Embedded component substrates moving forward
Appelt, B. K., Su, B., Lee, D., Yen, U., Hung, M.
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Low cost fcCSP based on cu pillar
Appelt, B. K., Chung, H., Chienfan Chen, Wang, R., Hung, M.
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Electromigration reliability of redistribution lines in wafer-level chip-scale packages
Yi-Shao Lai, Chin-Li Kao, Ying-Ta Chiu, Appelt, Bernd K.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Fine pitch Cu wire bonding - As good as gold
Appelt, B K, Chen, W T, Tseng, A, Yi-Shao Lai
Published in 2010 IEEE CPMT Symposium Japan (01.08.2010)
Published in 2010 IEEE CPMT Symposium Japan (01.08.2010)
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Conference Proceeding
Single sided substrates and packages based on laminate materials
Appelt, B.K., Su, B., Huang, A.S.F., Hsieh, T., Yi-Shao Lai
Published in 2010 International Symposium on Advanced Packaging Materials: Microtech (APM) (01.02.2010)
Published in 2010 International Symposium on Advanced Packaging Materials: Microtech (APM) (01.02.2010)
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Conference Proceeding