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Year of Publication 11.03.1993
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Process for producing ceramic circuit structures having conductive vias
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Year of Publication 16.08.1994
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Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates
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Year of Publication 01.02.1994
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VIA PASTE COMPOSITIONS AND USE THEREOF TO FORM CONDUCTIVE VIAS IN CIRCUITIZED CERAMIC SUBSTRATES
DUNCOMBE, PETER R, FAROOQ, SHAJI, NEISER, MARK O, VAN HISE, JON A, SHAW, ROBERT R, HUFFSMITH KNICKERBOCKER, SARAH, VALLABHANENI, RAO, WALKER, GEORGE F, COOPER, EMANUEL I, KIM, YOUNG-HO, KIM, JUNGIHL, AOUDE, FARID Y, PARK, JAE M, MULLER-LANDAU, FRIEDEL, RITA, ROBERT A, BROWNLOW, JAMES M, SHAW, THOMAS M, GIESS, EDWARD A
Year of Publication 03.02.1993
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Year of Publication 03.02.1993
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Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates
DUNCOMBE, PETER R, FAROOQ, SHAJI, NEISER, MARK O, VAN HISE, JON A, SHAW, ROBERT R, HUFFSMITH KNICKERBOCKER, SARAH, VALLABHANENI, RAO, WALKER, GEORGE F, COOPER, EMANUEL I, KIM, YOUNG-HO, KIM, JUNGIHL, AOUDE, FARID Y, PARK, JAE M, MULLER-LANDAU, FRIEDEL, RITA, ROBERT A, BROWNLOW, JAMES M, SHAW, THOMAS M, GIESS, EDWARD A
Year of Publication 16.12.1992
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Year of Publication 16.12.1992
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