Fabricating process of thin‐strain sensor by utilizing wafer‐level‐packaging techniques
Aono, Takanori, Kanamaru, Masatoshi, Ikeda, Hiroshi
Published in Electronics and communications in Japan (01.06.2024)
Published in Electronics and communications in Japan (01.06.2024)
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Journal Article
Wiring techniques for large size silicon probe using electroplating
Aono, Takanori, Kanamaru, Masatoshi, Kohno, Ryuji, Hosogane, Atsushi
Published in Electronics and communications in Japan (01.10.2020)
Published in Electronics and communications in Japan (01.10.2020)
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Journal Article
Method for Fabricating Multilevel Interconnection Structures Using Differential Delamination Energies between Metal and Silicon Oxide Thin Films
AONO, TAKANORI, IWASAKI, TOMIO, YOSHIMURA, YASUHIRO, NAKAYAMA, YOSHINORI
Published in Electronics and communications in Japan (01.04.2016)
Published in Electronics and communications in Japan (01.04.2016)
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Journal Article
Three-axis MEMS combined sensor for electronic stability control system
Jeong, Heewon, Goto, Yasushi, Aono, Takanori, Nakamura, Toshiaki, Hayashi, Masahide
Published in Electronics and communications in Japan (01.07.2012)
Published in Electronics and communications in Japan (01.07.2012)
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Journal Article
PRESSURE SENSOR MODULE AND METHOD FOR PRODUCING PRESSURE SENSOR MODULE
AONO Takanori, TANOUE Hidetsugu, SUZUKI Yoichiro, KANAMARU Masatoshi, IKEDA Hiroshi
Year of Publication 25.07.2024
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Year of Publication 25.07.2024
Patent
PRESSURE SENSOR MODULE AND DISPENSING DEVICE HAVING PRESSURE SENSOR MODULE
AONO Takanori, YAMASAKI Tatsuya, SUZUKI Yoichiro, KANAMARU Masatoshi, TAKAHASHI Takuya
Year of Publication 08.06.2023
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Year of Publication 08.06.2023
Patent