Organometallic adduct compounds and method of manufacturing integrated circuit device using the same
KOIDE TAKANORI, UCHIUZOU HIROYUKI, HARANO KAZUKI, PARK GYU HEE, TAKAHIRO YOSHII, FUSE WAKANA, CHO YOUN JOUNG, KIM JAE WOON, KIM YOUN SOO, AOKI YUTATO, RYU SEUNG MIN, SAITO KAZUYA, MANABE YOSHIKI, KIMURA MASAYUKI
Year of Publication 12.10.2022
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Year of Publication 12.10.2022
Patent