Three-dimensional silicon integration
Knickerbocker, J U, Andry, P S, Dang, B, Horton, R R, Interrante, M J, Patel, C S, Polastre, R J, Sakuma, K, Sirdeshmukh, R, Sprogis, E J, Sri-Jayantha, S M, Stephens, A M, Topol, A W, Tsang, C K, Webb, B C, Wright, S L
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Journal Article
Fabrication and characterization of robust through-silicon vias for silicon-carrier applications
Andry, P S, Tsang, C K, Webb, B C, Sprogis, E J, Wright, S L, Dang, B, Manzer, D G
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Journal Article
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections
Sakuma, K, Andry, P S, Tsang, C K, Wright, S L, Dang, B, Patel, C S, Webb, B C, Maria, J, Sprogis, E J, Kang, S K, Polastre, R J, Horton, R R, Knickerbocker, J U
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Journal Article
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
Knickerbocker, J. U., Andry, P. S., Buchwalter, L. P., Deutsch, A., Horton, R. R., Jenkins, K. A., Kwark, Y. H., McVicker, G., Patel, C. S., Polastre, R. J., Schuster, C. D., Sharma, A., Sri-Jayantha, S. M., Surovic, C. W., Tsang, C. K., Webb, B. C., Wright, S. L., McKnight, S. R., Sprogis, E. J., Dang, B.
Published in IBM journal of research and development (01.07.2005)
Published in IBM journal of research and development (01.07.2005)
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Journal Article
3D chip stacking with C4 technology
Dang, B, Wright, S L, Andry, P S, Sprogis, E J, Tsang, C K, Interrante, M J, Webb, B C, Polastre, R J, Horton, R R, Patel, C S, Sharma, A, Zheng, J, Sakuma, K, Knickerbocker, J U
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Journal Article
Imitation as a communication tool for online facial expression learning and recognition
Boucenna, S, Gaussier, P, Andry, P, Hafemeister, L
Published in 2010 IEEE/RSJ International Conference on Intelligent Robots and Systems (01.10.2010)
Published in 2010 IEEE/RSJ International Conference on Intelligent Robots and Systems (01.10.2010)
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Conference Proceeding
Dry Vertical Alignment Method for Multi-domain Homeotropic Thin-Film-Transistor Liquid Crystal Displays
Cai, C., Lien, A., Andry, P. S., Chaudhari, P., John, R. A., Galligan, E. A., Lacey, J. A., Ifill, H., Graham, W. S., Allen, R. D.
Published in Japanese Journal of Applied Physics (01.12.2001)
Published in Japanese Journal of Applied Physics (01.12.2001)
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Journal Article
Serious childhood angiomas: unsuccessful alpha-2b interferon treatment. A report of four cases
Teillac-Hamel, D, De Prost, Y, Bodemer, C, Andry, P, Enjolras, O, Sebag, G, Brunelle, F, Hubert, P, Nihoul-Fekete, C
Published in British journal of dermatology (1951) (01.10.1993)
Published in British journal of dermatology (1951) (01.10.1993)
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Floating-island TFT leakage caused by process step reduction
Tsujimura, T., Tokuhiro, O., Morooka, M., Miyamoto, T., Miwa, K., Yoshimura, Y., Andry, P., Libsch, F.
Published in IEEE transactions on electron devices (01.04.2002)
Published in IEEE transactions on electron devices (01.04.2002)
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Journal Article
IMC bonding for 3D interconnection
Sakuma, K, Sueoka, K, Kohara, S, Matsumoto, K, Noma, H, Aoki, T, Oyama, Y, Nishiwaki, H, Andry, P S, Tsang, C K, Knickerbocker, J U, Orii, Y
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Expression of GM-CSF receptor by Langerhans' cell histiocytosis cells
Emile, J F, Fraitag, S, Andry, P, Leborgne, M, Lellouch-Tubiana, A, Brousse, N
Published in Virchows Archiv : an international journal of pathology (01.09.1995)
Published in Virchows Archiv : an international journal of pathology (01.09.1995)
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Journal Article
2.5D and 3D technology challenges and test vehicle demonstrations
Knickerbocker, J. U., Andry, P. S., Colgan, E., Dang, B., Dickson, T., Gu, X., Haymes, C., Jahnes, C., Liu, Y., Maria, J., Polastre, R. J., Tsang, C. K., Turlapati, L., Webb, B. C., Wiggins, L., Wright, S. L.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
CD101 expression by Langerhans cell histiocytosis cells
BOULOC, A, BOULLAND, M.-L, BAGOT, M, GEISSMANN, F, FRAITAG, S, ANDRY, P, TEILLAC, D, BENSUSSAN, A, REVUZ, J, BOUMSELL, L, WECHSLER, J
Published in Histopathology (01.03.2000)
Published in Histopathology (01.03.2000)
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